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Custom BGA 2518 Heat Sink: Precision Thermal Control for Industrial & Embedded Systems

The BGA 2518 is a type of CPU socket used for Intel Xeon D processors. These processors are often found in embedded systems and other applications where space is at a premium. Effective cooling is essential to maintain the performance and reliability of BGA 2518 CPUs, especially in demanding environments. This article discusses a custom heatsink solution designed specifically for BGA 2518 processors

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Custom BGA 2518 Heat Sink Description

BGA 2518 Socket and Compatible CPUs The BGA 2518 socket is used by Intel Xeon D processors. These processors are designed for embedded applications, offering a balance of performance and power efficiency. Examples of processors that use the BGA 2518 socket include the Intel Xeon D-2191 (18-core, 86W) and the Intel Xeon D-2177NT (14-core, 105W).Heatsink Design and Materials Given the 120W power consumption, a robust cooling solution is required to prevent overheating and ensure stable operation. The heatsink features an aluminum base and aluminum fins, combined with three heat pipes. Aluminum is a lightweight and cost-effective material with good thermal conductivity. The aluminum base makes direct contact with the CPU, drawing heat away from the processor.

Key Features and Specifications

  • CPU Type:BGA 2518
  • Product Size: 120mm * 84mm * 28.5mm
  • CPU Hole Spacing: 69.2mm * 46mm
  • Fin Thickness:0.3mm
  • Fin Spacing: 1.7mm
  • Power Consumption: 120W
  • Material: Aluminum base + aluminum fin + 3 heat pipes

Applications This type of heatsink is suitable for a variety of applications, including

  • Embedded systems
  • Industrial PCs
  • Compact servers
  • Networking equipment

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