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Diamond-Copper-Aluminum-Series-Revolutionizing-Conductive-Materials-with-Diamond-Enhanced-All
Diamond-Copper-Aluminum-Series-Cutting-Edge-Innovations-in-Thermal-and-Electrical-Conductivit
Diamond-Copper-Aluminum-Series-Revolutionizing-Conductive-Materials-with-Diamond-Enhanced-All

Diamond Copper Aluminum Series

Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient.

Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper.

Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.

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Tungsten Copper Alloy Description

  • Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
  • Function: Excellent heat dissipation and mechanical strength.
  • Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
  • Sizes: Available in various forms and dimensions for precision applications.
  • Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

Tungsten Copper Alloy Technical/Data Sheet

Diamond-Copper-Aluminum-Series-Pioneering-Ultra-High-Performance-Composite-Materials

 

Model 80800930
Processor architecture Intel Socket 2011 Square ILM
Chassis architecture 2U Server and Up  ( Active )
size 89.5 x 89.5 x 69.0 mm
Power consumption 145W
Material Cu Base + AL Fin + 6025 Fan
Thermal paste Shin-Etsu X23-7783D Pre-Applied
Fan model TD6025B12HA
Rated voltage 12 VDC
Starting voltage 7.0 VDC
Rated current 0.45 A
Rotating speed 6800±10% RPM
Bearing Two Ball
Air volume 41.4CFM
wind pressure 14.74 mm H2O
noise 47.67 dBA
PWM function PWM Control
Safety certification UL & CE
Environmental protection level RoHS 2.0
Plug terminal 2510 – 4Pin; Pin1,4

Tungsten Copper Alloy Applications

  • Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
  • Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
  • Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
  • Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

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