Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient.
Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper.
Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.
| Model | 80800930 |
| Processor architecture | Intel Socket 2011 Square ILM |
| Chassis architecture | 2U Server and Up ( Active ) |
| size | 89.5 x 89.5 x 69.0 mm |
| Power consumption | 145W |
| Material | Cu Base + AL Fin + 6025 Fan |
| Thermal paste | Shin-Etsu X23-7783D Pre-Applied |
| Fan model | TD6025B12HA |
| Rated voltage | 12 VDC |
| Starting voltage | 7.0 VDC |
| Rated current | 0.45 A |
| Rotating speed | 6800±10% RPM |
| Bearing | Two Ball |
| Air volume | 41.4CFM |
| wind pressure | 14.74 mm H2O |
| noise | 47.67 dBA |
| PWM function | PWM Control |
| Safety certification | UL & CE |
| Environmental protection level | RoHS 2.0 |
| Plug terminal | 2510 – 4Pin; Pin1,4 |
Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.
✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available
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