



Diamond Copper Aluminum Series
Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient.
Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper.
Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.
Tungsten Copper Alloy Description
- Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
- Function: Excellent heat dissipation and mechanical strength.
- Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
- Sizes: Available in various forms and dimensions for precision applications.
- Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.
Tungsten Copper Alloy Technical/Data Sheet
Model | 80800930 |
Processor architecture | Intel Socket 2011 Square ILM |
Chassis architecture | 2U Server and Up ( Active ) |
size | 89.5 x 89.5 x 69.0 mm |
Power consumption | 145W |
Material | Cu Base + AL Fin + 6025 Fan |
Thermal paste | Shin-Etsu X23-7783D Pre-Applied |
Fan model | TD6025B12HA |
Rated voltage | 12 VDC |
Starting voltage | 7.0 VDC |
Rated current | 0.45 A |
Rotating speed | 6800±10% RPM |
Bearing | Two Ball |
Air volume | 41.4CFM |
wind pressure | 14.74 mm H2O |
noise | 47.67 dBA |
PWM function | PWM Control |
Safety certification | UL & CE |
Environmental protection level | RoHS 2.0 |
Plug terminal | 2510 – 4Pin; Pin1,4 |
Tungsten Copper Alloy Applications
- Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
- Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
- Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
- Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.