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High-Precision-and-Durability-Exploring-the-Benefits-of-Laser-Tungsten-Copper-Bars
The-Future-of-Industrial-Components-Laser-Tungsten-Copper-Bars-and-Their-Impact
High-Precision-and-Durability-Exploring-the-Benefits-of-Laser-Tungsten-Copper-Bars
The-Future-of-Industrial-Components-Laser-Tungsten-Copper-Bars-and-Their-Impact

Laser Tungsten Copper Bar

Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal” oxygen-free copper heat sinks was prevalent over a decade or two ago. The power density was relatively low, and tin was typicaly used as solder.Oxygen-free copper heat sinks can be utiized,nickel-plated instead of gold-plated,but gold-plated soldering offers betterreliabiity.The tungsten copper bar structure was developed to meet the demands for high power,high reliabiity,and long lifespan.

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Tungsten Copper Alloy Description

  • Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
  • Function: Excellent heat dissipation and mechanical strength.
  • Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
  • Sizes: Available in various forms and dimensions for precision applications.
  • Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

Tungsten Copper Alloy Technical/Data Sheet

 

Model 80800930
Processor architecture Intel Socket 2011 Square ILM
Chassis architecture 2U Server and Up  ( Active )
size 89.5 x 89.5 x 69.0 mm
Power consumption 145W
Material Cu Base + AL Fin + 6025 Fan
Thermal paste Shin-Etsu X23-7783D Pre-Applied
Fan model TD6025B12HA
Rated voltage 12 VDC
Starting voltage 7.0 VDC
Rated current 0.45 A
Rotating speed 6800±10% RPM
Bearing Two Ball
Air volume 41.4CFM
wind pressure 14.74 mm H2O
noise 47.67 dBA
PWM function PWM Control
Safety certification UL & CE
Environmental protection level RoHS 2.0
Plug terminal 2510 – 4Pin; Pin1,4

Tungsten Copper Alloy Applications

  • Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
  • Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
  • Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
  • Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

Early lasers primarily utiized tungsten copper C-Mount structures,which later transitioned to tungsten copper bars. Initially,W85Cu15 was predominant, but currently,W90Cu10 is the main composition.It is suggested to experiment with W93Cu7 in the future. Tungsten copper bars serve as conductors,heat sinks,and chip carriers.Galium nitride chips are sandwiched
between them and soldered with gold-tin solder.several laser modules utiize tungsten copper bars,varying from a few to dozens of pieces.

 

Innovative-Applications-of-Laser-Cut-Tungsten-Copper-Bars-in-High-Tech-Industries

In the early days, about 10 years ago, the power of laser chips was not high, and the requirements for tungsten copper bars were not stringent. Now,fhe power is increasing,and the demands tor tungsten copper bar size accuracy, thermal expansion coefficient matching,thermal conductivity,and coating bonding are becoming more rigorous. This is mainly evident in the need for the thermal expansion coefficient to be close to galium arsenide (5.9×10-6/k),maximizing thermal conductivity,experimenting with diamond composite materials,and enforcing strict control over key surfaces, finishes,edges (R10 microns),and coatings (nickel,gold,platinum, and locally prefabricated gold and tin).A decade ago,we were the sole manufacturerof tungsten copper bars in China, but now many manufacturers are entering this field.

Enhancing-Performance-with-Laser-Tungsten-Copper-Bars-A-Guide-to-Advanced-Materials

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