Guangdong, China
Global Engineering RFQ Review
ToneCooling T-HS202331 optical module liquid cold plate 16 port, product view
ToneCooling T-HS202331 optical module liquid cold plate 16 port, product view

Optical Module Liquid Cold Plate – 16-Port | T-HS202331

8 mm ultra-thin copper cold plate that cools sixteen 25 W optical transceivers (400 W total) across a switch or server front panel, ultrasonically welded to keep the wall thin over the module cages. 25% PGW at 1.2 LPM / 7.9 kPa and 40 °C inlet holds module contact surfaces below 52 °C — enabling fully liquid-cooled, fan-less network equipment.

  • 25 W × 16 at < 52 °C surface with 40 °C inlet — 12 K case-to-inlet rise on 25% PG / water (PGW)
  • 7.9 kPa at 1.2 LPM — moderate pressure drop, sized for standard CDU branches
  • 416 × 122 × 8 mm — 8 mm profile; port position to your chassis layout
  • Ultrasonic-welded copper, 0.6 MPa rated — every unit leak-tested before shipment
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Engineering overview

  • Thermal: 12 K case-to-inlet rise at rated load, measured at the contact area with 25% PG / water (PGW). Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
  • Hydraulic: 7.9 kPa at 1.2 LPM — moderate pressure drop, sized for standard CDU branches; validated on our flow bench at the rated inlet temperature of 40 °C.
  • Mechanical: 416 × 122 × 8 mm copper plate, 8 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
  • Construction: Ultrasonic Welding — a leak-tight brazed/welded coolant path qualified by 100% pressure testing; 0.6 MPa working pressure, 100% pressure-tested.
  • Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202331 Specifications (as tested)

ParameterValue
ModelT-HS202331
Target deviceOptical Module — 16-Port
Rated heat load25 W × 16
Coolant (as tested)25% PG / water (PGW)
Inlet coolant temperature40 °C
Max. plate surface temperature< 52 °C
Case-to-inlet thermal resistance≈ 0.480 °C/W per device (from rated point)
Flow rate / pressure drop1.2 LPM / 7.9 kPa
Working pressure rating0.6 MPa
Dimensions (L × W × H)416 × 122 × 8 mm
Base materialCopper
Bonding processUltrasonic Welding
Leak test100% pressure-tested before shipment

Typical applications

  • Liquid-cooled data center switches
  • 800G / 1.6T optical module cages
  • Fan-less network equipment

Ordering & RFQ

How to order: quote model T-HS202331 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 40 °C inlet with 25% PG / water (PGW). Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

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