Abstract: Facing server CPU thermal power dissipation as high as 400W, traditional air cooling solutions are approaching their limits. This article provides an in-depth analysis of a server liquid cooling simulation solution based on a 20% ethylene glycol solution, demonstrating how to successfully control the temperature of dual CPUs below 66°C in a 40°C ambient temperature environment. Through comprehensive data from multiple power scenarios (300W/350W/400W), it offers a reliable liquid cooling design template and performance verification guide for Thermal Design Engineers and Thermal Management Engineers.
1. Core Thermal Challenges: High Power Dissipation and Space Constraints — Server liquid cooling simulation
In the fields of high-performance computing and data centers, Thermal Management Engineers are facing unprecedented challenges:
- Continuously Rising CPU Power: Single CPU power exceeding 400W has become a trend.
- Compact Space: The limited space within servers places extremely high demands on heatsink efficiency and structure.
- Reliability Requirements: It is essential to ensure the junction and case temperatures of core components remain within safe limits under prolonged high load.
This simulation solution targets a server equipped with two high-power CPUs (70*50mm size), aiming to address all the above pain points through a Liquid Cooling System.
2. Key Simulation Inputs: Building an Accurate Model — Server liquid cooling simulation
A reliable simulation starts with the precise modeling of real-world conditions. The core input parameters of this solution provide a clear modeling reference for Thermal Design Engineers:
- Cooling Type: Water/Liquid Cooling System (Closed Loop)
- Ambient Temperature: 40°C (Simulating typical data center operating conditions)
- Coolant: 20% Ethylene Glycol Solution, Inlet Temperature 40°C
- System Flow Rate: 0.8 L/MIN
- Heat Source: 2 CPUs, Power Dissipation: 300W / 350W / 400W (Multi-scenario testing)
- Core Process: Brazing + Skiving (Ensuring high thermal conductivity and structural strength of the cold plate)
- Connection Method: Hose connection for the entire liquid cooling system
3. In-Depth Analysis of Simulation Results: Verifying Performance with Data — Server liquid cooling simulation
The simulation results comprehensively verify the effectiveness of this liquid cooling solution from three dimensions: Temperature Control, Flow Resistance Characteristics, and Velocity Distribution.
3.1 Temperature Control: Excellent Performance Under Multiple Power Scenarios
Temperature is the most critical indicator for Thermal Management Engineers. The performance of this solution under three power levels is as follows:
Power Scenario | Max Fluid Temp | ΔT (Inlet-Outlet) | CPU-1 Temp | CPU-2 Temp |
|---|---|---|---|---|
300W | 57.2°C | 11.2°C | 53.9°C | 59.6°C |
350W | 60.0°C | 13.0°C | – | 62.8°C |
400W | 62.9°C | 22.9°C | 58.6°C | 66.1°C |
Key Conclusion: Even under the most demanding 400W dual-CPU condition, the system successfully suppresses the maximum CPU temperature to 66.1°C, demonstrating the extreme efficiency of the liquid cooling path design.
3.2 Flow Resistance & Pressure Distribution: Key to System Energy Consumption
- System Max Pressure Drop: Pmax = 8.7 Kpa
- Analysis: The low flow resistance implies lower power requirements for the pump, helping to reduce the energy consumption and operating noise of the entire cooling system, which is crucial for optimizing the PUE (Power Usage Effectiveness) of data centers.
3.3 Velocity Distribution: Ensuring Uniform Heat Dissipation
- Max Velocity inside Cold Plate: ~1.06 m/s
- Analysis: The velocity contour shows the coolant is evenly distributed within the flow channels without dead zones, ensuring temperature uniformity on the cold plate surface and avoiding local hot spots.
4. Summary: Value and Insights for Thermal Design Engineers
This simulation report fully demonstrates that this Server Liquid Cooling Solution can efficiently handle high heat flux densities up to the 400W level at a 40°C ambient temperature, with low system flow resistance and reliable performance.
For your project, the value of this case study lies in:
- Solution Feasibility Verification: Provides solid data backing for applying cost-effective, high-efficiency liquid cooling solutions in high-power servers.
- Design Reference: Detailed parameters (e.g., ethylene glycol concentration, flow rate, process selection) provide key inputs for your preliminary design.
- Decision Support: Comparative data from multiple power scenarios helps you evaluate the system’s thermal performance under different loads and optimize product planning.
- Risk Mitigation: Predicting system pressure drop and temperature distribution in advance through simulation avoids costly design modifications and hardware damage risks later.
If you are looking for reliable solutions for the thermal management challenges of your next-generation servers, high-performance computing equipment, or industrial computers, our professional team can provide you with the same level of professional thermal simulation services and customized liquid cooling solutions.
Take Action Now, Let Our Professional Team Safeguard Your Product’s Thermal Performance!
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For industry standards and best practices, refer to ASHRAE thermal guidelines.
What Is Server Liquid Cooling Simulation Solution?
Does ToneCooling offer OEM and ODM services?
Yes. ToneCooling provides full OEM and ODM services including custom design, prototyping, thermal simulation, and volume production. We serve customers in North America, Europe, and Asia-Pacific with engineering support and samples within 2–4 weeks.
What materials are used in ToneCooling liquid cold plates?
ToneCooling manufactures cold plates in aluminum (6061/6063), copper (C1100/C1020), and stainless steel. Aluminum FSW cold plates are ideal for high-volume EV and industrial applications, while copper brazed cold plates provide maximum thermal conductivity (398 W/m·K) for high heat flux electronics.
What is the typical lead time for custom cold plates?
Prototype samples are delivered within 2–4 weeks. Production orders typically ship within 4–6 weeks after sample approval. ToneCooling responds to all quote requests within 24 business hours.
Get a Custom Thermal Solution from ToneCooling
ToneCooling is a professional liquid cooling solution provider specializing in custom cold plates, AIO coolers, and advanced thermal management systems. With ISO 9001:2015 certified manufacturing, we deliver prototype samples within 2–4 weeks. Contact ToneCooling today for a free consultation and quote — we respond within 24 business hours.
Related ToneCooling Resources
Industry References & Standards
Need a Custom Liquid Cold Plate?
Server Liquid Cooling Simulation Solution is a high-performance thermal management solution engineered by ToneCooling for demanding applications.
ToneCooling engineers design thermal solutions for your specific requirements. Get an engineering RFQ review based on your uploaded requirements.
Analysis Server Liquid Cooling is a critical component in modern thermal management. ToneCooling engineers this solution for AI servers, data centers, EV batteries, and power electronics requiring high-performance liquid cooling.
Analysis Server Liquid Cooling: Key Specifications
When evaluating analysis server liquid cooling, engineers consider thermal resistance, pressure drop, flow rate, and material compatibility. ToneCooling provides detailed specs for every analysis server liquid cooling design, backed by CFD simulation and testing.
Why Choose ToneCooling for Analysis Server Liquid Cooling
ToneCooling has manufactured over 50,000 analysis server liquid cooling units for global OEM customers. Our analysis server liquid cooling production features vacuum brazing furnaces below 10⁻⁴ mbar, FSW machines with ≤0.02mm flatness, and helium leak detection at 10⁻⁸ mbar·L/s. Every analysis server liquid cooling undergoes 100% pressure testing at 25 bar.
Our engineering team provides free analysis server liquid cooling design consultation, CFD simulation, and rapid prototyping in 7-14 days. Production analysis server liquid cooling orders ship in 4-6 weeks under ISO 9001:2015 quality management.
Need a Custom Liquid Cold Plate?
ToneCooling engineers design thermal solutions for your requirements. Response within 24-48 hours.
Last Updated: 2026-04-08
DR Kevin, Thermal Engineer, ToneCooling
