This comprehensive guide covers bga 2518 heat sink solutions for industrial and OEM applications. ToneCooling provides expert insights on bga 2518 heat sink technology and implementation.
The BGA 2518 is a type of CPU socket used for Intel Xeon D processors. These processors are often found in embedded systems and other applications where space is at a premium. Effective cooling is essential to maintain the performance and reliability of BGA 2518 CPUs, especially in demanding environments. This article discusses a custom heatsink solution designed specifically for BGA 2518 processors.Key Features and Specifications：
- CPU Type：BGA 2518
- Product Size： 120mm * 84mm * 28.5mm
- CPU Hole Spacing： 69.2mm * 46mm
- Fin Thickness：0.3mm
- Fin Spacing： 1.7mm
- Power Consumption： 120W
- Material： Aluminum base + aluminum fin + 3 heat pipes
BGA 2518 Socket and Compatible CPUs The BGA 2518 socket is used by Intel Xeon D processors. These processors are designed for embedded applications, offering a balance of performance and power efficiency. Examples of processors that use the BGA 2518 socket include the Intel Xeon D-2191 (18-core, 86W) and the Intel Xeon D-2177NT (14-core, 105W).Heatsink Design and Materials Given the 120W power consumption, a robust cooling solution is required to prevent overheating and ensure stable operation. The heatsink features an aluminum base and aluminum fins, combined with three heat pipes. Aluminum is a lightweight and cost-effective material with good thermal conductivity. The aluminum base makes direct contact with the CPU, drawing heat away from the processor. The heat is then transferred to the aluminum fins, which provide a large surface area for heat dissipation into the surrounding air. Heat pipes further enhance the cooling process by efficiently transferring heat from the base to the fins. Heatsink Dimensions and Hole Spacing The heatsink has dimensions of 120mm * 84mm * 28.5mm, providing a compact yet effective cooling solution. The CPU hole spacing is 69.2mm * 46mm, ensuring compatibility with BGA 2518 CPU mounting configurations. The fin thickness is 0.3mm, and the fin spacing is 1.7mm, optimized for balancing heat dissipation and airflow. Importance of Effective Cooling Effective cooling is crucial for BGA 2518 CPUs due to the following reasons:
- Thermal Management : Prevents overheating, ensuring stable operation and prolonging the lifespan of the CPU.
- Performance Optimization： Maintains optimal CPU performance by preventing thermal throttling.
- Reliability： Ensures reliable operation in demanding environments, reducing the risk of system failures.
Applications This type of heatsink is suitable for a variety of applications, including:
- Embedded systems
- Industrial PCs
- Compact servers
- Networking equipment
Conclusion A well-designed cooling solution is essential for maintaining the performance and reliability of BGA 2518 CPUs. The described aluminum heatsink, with its heat pipes and optimized dimensions, provides an effective thermal management solution for these processors.
For industry standards and best practices, refer to Electronics Cooling Magazine.
| Parameter | ToneCooling Specification |
|---|---|
| Material | Copper T2 / 6061 aluminum |
| Welding | TLP diffusion welding |
| Test pressure | 1 MPa (He leak + N₂ hold) |
| Coolant | PG25 (25% propylene glycol) |
| Custom design | Yes — DXF/STEP accepted |
Frequently Asked Questions — Bga 2518 heat sink
Does ToneCooling offer OEM and ODM services? — Bga 2518 heat sink
Yes. ToneCooling provides full OEM and ODM services including custom design, prototyping, thermal simulation, and volume production. We serve customers in North America, Europe, and Asia-Pacific with engineering support and samples within 2–4 weeks.
What types of heat sinks does ToneCooling manufacture? — Bga 2518 heat sink
ToneCooling manufactures extruded, machined, bonded-fin, and skived heat sinks in aluminum and copper. We also produce liquid cold plates and vapor chambers for applications exceeding air cooling capacity.
How do I select the right heat sink for my application?
Selection depends on thermal design power (TDP), available airflow, space constraints, and cost targets. Contact ToneCooling with your thermal requirements for application-specific recommendations.
Get a Custom Thermal Solution from ToneCooling
ToneCooling is a professional liquid cooling solution provider specializing in custom cold plates, AIO coolers, and advanced thermal management systems. With ISO 9001:2015 certified manufacturing, we deliver prototype samples within 2–4 weeks. Contact ToneCooling today for a free consultation and quote — we respond within 24 business hours.
References: ASHRAE thermal standards, Wikipedia: Heat Sink Technology
About ToneCooling
ToneCooling is a professional OEM manufacturer specializing in custom liquid cooling solutions, cold plates, and thermal management systems. With over 10 years of experience serving global OEM customers, we deliver high-performance cooling solutions for servers, data centers, electric vehicles, energy storage systems, and industrial applications. Our engineering team provides end-to-end support from thermal simulation and design optimization to prototype development and mass production. All products are manufactured in our ISO-certified facilities with rigorous quality control. Contact ToneCooling for custom cooling solutions tailored to your project requirements.
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Bga 2518 Heat Sink is a high-performance thermal management solution engineered by ToneCooling for demanding applications.
ToneCooling engineers design thermal solutions for your specific requirements. Get an engineering RFQ review based on your uploaded requirements.
Heat Sink Thermal Management is a critical component in modern thermal management. ToneCooling engineers this solution for AI servers, data centers, EV batteries, and power electronics requiring high-performance liquid cooling.
Heat Sink Thermal Management: Key Specifications
When evaluating heat sink thermal management, engineers consider thermal resistance, pressure drop, flow rate, and material compatibility. ToneCooling provides detailed specs for every heat sink thermal management design, backed by CFD simulation and testing.
Why Choose ToneCooling for Heat Sink Thermal Management
ToneCooling has manufactured over 50,000 heat sink thermal management units for global OEM customers. Our heat sink thermal management production features vacuum brazing furnaces below 10⁻⁴ mbar, FSW machines with ≤0.02mm flatness, and helium leak detection at 10⁻⁸ mbar·L/s. Every heat sink thermal management undergoes 100% pressure testing at 25 bar.
Our engineering team provides free heat sink thermal management design consultation, CFD simulation, and rapid prototyping in 7-14 days. Production heat sink thermal management orders ship in 4-6 weeks under ISO 9001:2015 quality management.
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Last Updated: 2026-04-08
DR Kevin, Thermal Engineer, ToneCooling
