The BGA 2518 is a type of CPU socket used for Intel Xeon D processors. These processors are often found in embedded systems and other applications where space is at a premium. Effective cooling is essential to maintain the performance and reliability of BGA 2518 CPUs, especially in demanding environments. This article discusses a custom heatsink solution designed specifically for BGA 2518 processors.Key Features and Specifications：
- CPU Type：BGA 2518
- Product Size： 120mm * 84mm * 28.5mm
- CPU Hole Spacing： 69.2mm * 46mm
- Fin Thickness：0.3mm
- Fin Spacing： 1.7mm
- Power Consumption： 120W
- Material： Aluminum base + aluminum fin + 3 heat pipes
BGA 2518 Socket and Compatible CPUs The BGA 2518 socket is used by Intel Xeon D processors. These processors are designed for embedded applications, offering a balance of performance and power efficiency. Examples of processors that use the BGA 2518 socket include the Intel Xeon D-2191 (18-core, 86W) and the Intel Xeon D-2177NT (14-core, 105W).Heatsink Design and Materials Given the 120W power consumption, a robust cooling solution is required to prevent overheating and ensure stable operation. The heatsink features an aluminum base and aluminum fins, combined with three heat pipes. Aluminum is a lightweight and cost-effective material with good thermal conductivity. The aluminum base makes direct contact with the CPU, drawing heat away from the processor. The heat is then transferred to the aluminum fins, which provide a large surface area for heat dissipation into the surrounding air. Heat pipes further enhance the cooling process by efficiently transferring heat from the base to the fins. Heatsink Dimensions and Hole Spacing The heatsink has dimensions of 120mm * 84mm * 28.5mm, providing a compact yet effective cooling solution. The CPU hole spacing is 69.2mm * 46mm, ensuring compatibility with BGA 2518 CPU mounting configurations. The fin thickness is 0.3mm, and the fin spacing is 1.7mm, optimized for balancing heat dissipation and airflow. Importance of Effective Cooling Effective cooling is crucial for BGA 2518 CPUs due to the following reasons:
- Thermal Management : Prevents overheating, ensuring stable operation and prolonging the lifespan of the CPU.
- Performance Optimization： Maintains optimal CPU performance by preventing thermal throttling.
- Reliability： Ensures reliable operation in demanding environments, reducing the risk of system failures.
Applications This type of heatsink is suitable for a variety of applications, including:
- Embedded systems
- Industrial PCs
- Compact servers
- Networking equipment
Conclusion A well-designed cooling solution is essential for maintaining the performance and reliability of BGA 2518 CPUs. The described aluminum heatsink, with its heat pipes and optimized dimensions, provides an effective thermal management solution for these processors.
