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LGA7529 CPU Cooler – High Performance Cooling Solutions

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The LGA7529 CPU cooler is designed for Intel server processors with the LGA 7529 socket. These coolers come in various designs, including active heat sink, passive cooler, and liquid cooler options, to suit different server form factors and cooling requirements.Key Features and Specifications:

  • Socket Type:LGA 7529.
  • CPU TDP (Thermal Design Power): Supports a wide range of TDP, including 225W, 400W, 450W, 500W, 570W, and up to 700W, depending on the specific model.
  • Form Factor: Designed for 1U, 2U, and 3U servers.
  • Cooling Type:  Available in passive, active (with fans), and liquid cooling solutions.
  • Materials:  Typically made with aluminum fins, copper base, and heat pipes for efficient heat dissipation. Some coolers use a refined nickel-plated mirror copper base.
  • Heat Pipes:  Many models feature multiple heat pipes (e.g., 6 or 8) to enhance thermal conductivity.
  • Dimensions: Vary depending on the design, with some examples being 126.8 x 97.8 x 64 mm and 126.8mm103mm121.3mm.
  • Fan Specifications (for active coolers):
    • Speed: PWM (Pulse Width Modulation) fans with speeds ranging from 1000-2200 RPM up to 12000 RPM, or even 18000 RPM in some liquid coolers.
    • Airflow: Up to 124 CFM (cubic feet per minute)7.
    • Noise Level: Varies, with some models operating as low as 1.39 dBA and others reaching up to 57 dBA or higher at maximum speed.
    • Bearing Type: Typically double ball bearings for durability.
  • Voltage: Generally operates at 12V DC.
  • CPU Hole Spacing: 81mm*69mm.

Cooling Solutions:

  • Passive Coolers:  These rely on heat sinks and natural convection for cooling, suitable for lower TDP CPUs and environments with good airflow.
  • Active Coolers:  Utilize fans to force air through the heat sink, providing more effective cooling for higher TDP CPUs.
  • Liquid Coolers:  Offer the highest cooling performance, using a liquid coolant to transfer heat away from the CPU to a radiator. These are particularly effective for high-performance servers.

Considerations:

  • TDP:  Ensure the cooler supports the TDP of the CPU being used.
  • Server Form Factor:  Choose a cooler that fits within the server’s height constraints (e.g., 1U, 2U, 3U).
  • Noise Level:  Consider the noise generated by active coolers, especially in noise-sensitive environments.
  • Installation: Verify compatibility with the motherboard and case.
  • Material Quality: Copper base coolers generally offer better thermal conductivity than aluminum.

The optimal LGA7529 CPU cooler depends on the specific requirements of the server and its operating environment.

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