LGA1700 1Z03 1U server CPU air cooler view 2

LGA1700 1Z03 1U server CPU air cooler view 3

LGA1700-1Z03 1U Server CPU Air Cooler | Intel LGA1700, 125 W

LGA1700-1Z03 is a 1U CPU air cooler for Intel LGA1700 processors, rated for a 125 W thermal load. Solid-metal construction — copper — 90 × 89 × 27 mm overall, PWM fan (PWM 1500-6600RPM). Mounting hole pitch 78 x 78 mm.

125 W rated — Intel Core 12th–14th Gen (LGA1700)
90 × 89 × 27 mm — 27 mm profile for 1U chassis
Copper
PWM fan, 1500-6600RPM — double ball bearings, 12 V

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Engineering overview

Thermal: rated 125 W in a 1U chassis with front-to-back airflow. Fin thickness —, fin spacing —; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Fan: PWM 1500-6600RPM, 4-pin PWM, Double Ball Bearings, 12 V — speed follows the board fan curve.
Mechanical: 90 × 89 × 27 mm; mounting hole pitch 78 x 78 mm; retention hardware for Intel LGA1700 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA1700-1Z03 Specifications

Parameter	Value
Model	LGA1700-1Z03
Product type	1U server CPU air cooler
Socket / platform	LGA1700 (square ILM) — Intel Core 12th–14th Gen (LGA1700)
Rated thermal load (TDP)	125 W
Overall size (L × W × H)	90 × 89 × 27 mm
Mounting hole pitch	78 x 78 mm
Base / fin material	Copper
Fan speed	PWM 1500-6600RPM
Rated voltage	12 V
Bearing	Double Ball Bearings
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA1700-1Z03 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.