The TC-LGA3647-W1 CPU Cooler is a high-efficiency thermal solution engineered for Intel’s LGA 3647 socket, supporting Xeon Scalable processors used in data centers, workstations, and enterprise environments. With its robust design, superior heat dissipation, and easy installation, it meets the cooling demands of modern high-performance computing (HPC) and server applications.
Designed for Intel LGA 3647 Socket
Fully compatible with Intel Xeon Scalable processors (Skylake-SP, Cascade Lake-SP, and Cooper Lake-SP), the TC-LGA3647-W1 ensures secure mounting and optimal thermal interface.
High-Density Aluminum Heatsink
A large surface area with tightly packed aluminum fins allows for efficient heat transfer and rapid dissipation, maintaining CPU performance under heavy workloads.
120mm High-Performance PWM Fan
The cooler comes equipped with a powerful 120mm fan featuring PWM control, which adjusts fan speed based on temperature to balance airflow and noise levels.
Reliable Mounting Bracket
Engineered for stability, the mounting mechanism provides firm contact with the CPU, suitable for tower, rackmount, and vertical airflow chassis designs.
Pre-Applied Thermal Compound
Pre-applied high-quality thermal paste ensures fast, clean installation and maximizes thermal conductivity between the cooler and CPU surface.
Ideal for enterprise-grade servers running virtual machines, databases, and cloud infrastructure. The cooler supports 24/7 operation under sustained high CPU loads, making it suitable for large-scale deployments.
Used in workstations for applications like AI modeling, 3D rendering, CAD, and scientific computing, the cooler provides reliable thermal performance to ensure stable CPU clock speeds during long processing sessions.
For distributed computing environments that require Xeon-level processing power outside of traditional data centers, the TC-LGA3647-W1 enables reliable performance in compact server nodes.
The cooler is a solid choice for servers managing heavy I/O operations such as NAS, SAN, and high-speed networking equipment, where consistent CPU cooling ensures uninterrupted data flow.
Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.
✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available
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