A heat pipe radiator heat sink moves heat from high-power IGBT modules to a large fin area, lowering module temperature without a liquid loop. ToneCooling designs heat pipe and liquid cooling solutions for IGBT modules.
Liquid cooling cold plate Overview
Background Introduction
Insulated Gate Bipolar Transistor (IGBT) modules are extensively utilized in energy conversion and transmission systems, particularly in electric vehicles, rail transit, ultra-high voltage power transmission, and other applications. In recent years, the power density of IGBT modules has continuously improved, leading to a significant increase in heat output per unit volume. Elevated temperatures can adversely affect the operational safety of IGBT modules, making effective thermal management increasingly critical.
Traditional active cooling technology, which relies on enhanced convection and conduction, is commonly employed in the cooling of IGBT modules due to its benefits, including efficient heat dissipation and broad adaptability. However, the increase in volume, weight, and energy consumption associated with the components of active cooling systems significantly restricts their application in integrated IGBT module cooling.
Passive cooling strategies, including phase change materials, heat pipe radiators, and radiation cooling, are lightweight, eliminate parasitic energy consumption, and provide effective solutions for the thermal management of IGBT modules. Among these, radiation cooling technology serves as a passive heat dissipation method, where heat is transferred from the heating surface to the surrounding environment through electromagnetic waves. The radiation heat flux primarily depends on the surface emissivity and temperature. High-emissivity coatings are crucial for managing thermal conditions in high-temperature environments within compact spaces. Heat pipe radiators (HPRs) represent another effective passive thermal management approach, offering advantages such as high heat transfer efficiency and robust reliability. However, HPRs are typically constructed from metal materials like copper and aluminum, which possess low intrinsic emissivity, thereby inhibiting radiation heat transfer. Consequently, integrating radiation cooling coatings with heat pipe radiators is anticipated to enhance heat dissipation performance by improving radiation heat transfer.
Recently, Li Yong and Yang Hui from the Institute of Physical and Chemical Technology at the Chinese Academy of Sciences, along with Xu Linli’s team from the Hong Kong Polytechnic University, designed a radiation-enhanced heat pipe radiator (REHPR) for the thermal management of high-power IGBT modules. The REHPR developed in this study significantly improved the heat dissipation performance of traditional heat pipe radiators through the application of a high-emissivity coating (ε = 0.93). Under a wind speed of 1 m/s and a heat load of 1500 W, the startup time and temperature rise distribution were reduced by 9% and 15.5%, respectively. Additionally, the junction temperature of the IGBT module decreased by 8.1°C and 6.8°C under heating powers of 120 W for natural convection and 1500 W for forced convection, respectively, while the thermal resistance was reduced by up to 12.5%. This study offers an effective solution to the challenge of local heat dissipation in high-power electronic devices. Future research will focus on the long-term effectiveness of the coating to promote its application across various fields. The research team plans not only to investigate the long-term stability of the coating but also to explore further optimization of the coating material composition and improvements in heat sink structure design to achieve superior heat dissipation performance and address thermal management challenges in additional areas. The findings were published in the journal *Applied Thermal Engineering* under the title “Development and Performance Study of a Radiation-Enhanced Heat Pipe Radiator for Cooling High-Power IGBT Modules.”
References:insight Thermal Management
For industry standards and best practices, refer to IEEE.
Frequently Asked Questions
Does ToneCooling offer OEM and ODM services?
Yes. ToneCooling provides full OEM and ODM services including custom design, prototyping, thermal simulation, and volume production. We serve customers in North America, Europe, and Asia-Pacific with engineering support and samples within 4–6 weeks.
What materials are used in ToneCooling liquid cold plates?
ToneCooling manufactures cold plates in aluminum (6061/6063), copper (C1100/C1020), and stainless steel. Aluminum FSW cold plates are ideal for high-volume EV and industrial applications, while copper cold plates provide the highest thermal conductivity for high heat flux electronics.
What is the typical lead time for custom cold plates?
Prototype samples are delivered within 4–6 weeks. Production orders typically ship within 6–8 weeks after sample approval. An engineer reviews every RFQ and replies by email with next steps.
Get a Custom Thermal Solution from ToneCooling
ToneCooling is a professional liquid cooling solution provider specializing in custom cold plates, AIO coolers, and advanced thermal management systems. With ISO 9001 quality management and our own manufacturing facility in Huizhou, China, we deliver prototype samples typically within 4–6 weeks. Contact ToneCooling today for a free consultation and quote. An engineer reviews every RFQ and replies by email with next steps.
References: ASHRAE thermal standards
Why Choose ToneCooling for Liquid cooling cold plate
ToneCooling provides professional liquid cooling cold plate solutions with custom designs, engineering review and prototype samples. Our liquid cooling cold plate products serve data center, EV, industrial, and semiconductor applications worldwide.
Contact ToneCooling for custom liquid cooling cold plate solutions. Visit tonecooling.com or email info@tonecooling.com. US: +1 (832) 720-7542. An engineer reviews every RFQ and replies by email with next steps.
Why Choose ToneCooling for IGBT Liquid Cold Plate
Engineering review and prototype planning are based on the project requirements. Custom prototype lead time is normally 4–6 weeks after drawing approval and order confirmation; confirm the production schedule in the quotation.
Need a Custom Liquid Cold Plate?
ToneCooling engineers review your drawings and requirements and reply by email with next steps.
Last updated: 2026-10-02
