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Aluminum-Silicon-Carbide-Series-Pioneering-the-Future-of-Metal-Matrix-Composites
Aluminum-Silicon-Carbide-Series-Innovative-Solutions-in-Thermal-Management-Materials
Aluminum-Silicon-Carbide-Series-Pioneering-the-Future-of-Metal-Matrix-Composites
Aluminum-Silicon-Carbide-Series-Innovative-Solutions-in-Thermal-Management-Materials

Aluminum Silicon Carbide Series

CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum’s low thermal expansion coefficient and copper’s high thermal conductivity.The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness.Additionally,the copper-coated surface faciitates electroplating.s-CMC is a multi-layer CMC with better symmetry.Hs-CMC is a multi-layer composite sheet with holes in the core molybdenum plate.The central core hole is filed with oxygen-free copper,enhancing thermal conductivity in the Z direction.This unique variety was developed by our company in collaboration with kyocera for 5G power devices.

OurCeramic MatrixComposite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

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Tungsten Copper Alloy Description

  • Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
  • Function: Excellent heat dissipation and mechanical strength.
  • Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
  • Sizes: Available in various forms and dimensions for precision applications.
  • Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

Tungsten Copper Alloy Technical/Data Sheet

Aluminum-Silicon-Carbide-Series-Advancing-High-Strength-Lightweight-Composites

Model 80800930
Processor architecture Intel Socket 2011 Square ILM
Chassis architecture 2U Server and Up  ( Active )
size 89.5 x 89.5 x 69.0 mm
Power consumption 145W
Material Cu Base + AL Fin + 6025 Fan
Thermal paste Shin-Etsu X23-7783D Pre-Applied
Fan model TD6025B12HA
Rated voltage 12 VDC
Starting voltage 7.0 VDC
Rated current 0.45 A
Rotating speed 6800±10% RPM
Bearing Two Ball
Air volume 41.4CFM
wind pressure 14.74 mm H2O
noise 47.67 dBA
PWM function PWM Control
Safety certification UL & CE
Environmental protection level RoHS 2.0
Plug terminal 2510 – 4Pin; Pin1,4

Tungsten Copper Alloy Applications

  • Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
  • Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
  • Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
  • Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.
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