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Silver tungsten steel alloy lying flat on white plate
Flat lay of various silver tungsten steel alloys on white plate
Silver tungsten steel alloy lying flat on white plate
Silver tungsten steel alloy lying flat on white plate
Silver tungsten steel alloy lying flat on white plate
Silver tungsten steel alloy lying flat on white plate
Flat lay of various silver tungsten steel alloys on white plate
Silver tungsten steel alloy lying flat on white plate
Silver tungsten steel alloy lying flat on white plate
Silver tungsten steel alloy lying flat on white plate

Molybdenum copper series

Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily, MoxCuy, where x+y=100. The following table shows only a portion of the commonly used grades. Our molybdenum-copper alloy can achieve almost completely dense, defect-free, fine-grained structure. The air tightness of the helium mass spectrometer leak material is <5×10-9 Pa/m3.s, which is comparable to foreign products. Compared with tungsten copper, molybdenum copper has lower density and better rollability, making it suitable for the production of thin strip products. Additionally, molybdenum copper can be stamped, making it suitable for the cost-effective mass production of heat sink parts.

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Molybdenum copper series Description

Molybdenum copper series: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity. Function: Excellent heat dissipation and mechanical strength. Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs. Sizes: Available in various forms and dimensions for precision applications. Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

Molybdenum copper series Technical/Data Sheet

Model Processor architecture
80800930 Intel Socket 2011 Square ILM
Fan model Rated voltage
TD6025B12HA 12 VDC
wind pressure noise
14.74 mm H2O 47.67 dBA
Chassis architecture size
2U Server and Up  ( Active ) 89.5 x 89.5 x 69.0 mm
Starting voltage Rated current
7.0 VDC 0.45 A
PWM function Safety certification
PWM Control UL & CE
Power consumption Material
145W Cu Base + AL Fin + 6025 Fan
Rotating speed Bearing
6800±10% RPM Two Ball
Environmental protection level Plug terminal
RoHS 2.0 2510 – 4Pin; Pin1,4防呆
Thermal paste Air volume
Shin-Etsu X23-7783D Pre-Applied 41.4CFM

1..Electronics Cooling Applications 2.Aerospace and Defense Applications 3.Electrical Contacts and Switchgear Applications 4.Medical equipment Applications

Molybdenum copper series provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing
energy costs, and enhancing server performance and reliability in high-density environments
2.Molybdenum copper series offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power,
maintain stability, and enhance efficiency in demanding high-performance computing environments.
3.Molybdenum copper series provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing
component overheating, and enhancing the performance and longevity of automation equipment.
4.Molybdenum copper series delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing
overheating, and extending the lifespan of critical devices in healthcare environments.

Unlock Superior Performance with Molybdenum Copper Series for Advanced Industrial Applications

The Molybdenum Copper Series represents a significant advancement in materials engineering, offering exceptional thermal and electrical conductivity combined with high strength and durability. These unique properties make molybdenum copper alloys ideal for a wide range of industrial applications, including electronics, aerospace, and power generation.

Key Benefits of Molybdenum Copper Alloys
1.
High Thermal Conductivity: Molybdenum copper alloys provide excellent heat dissipation, making them perfect for use in high-power electronic devices and thermal management systems.
2.
Superior Electrical Conductivity: These alloys ensure efficient electrical performance, which is crucial for applications in power electronics and electrical contacts.
3.
Enhanced Mechanical Strength: The combination of molybdenum and copper results in a material that can withstand high mechanical stresses, making it suitable for demanding environments.
4.
Corrosion Resistance: Molybdenum copper alloys offer good resistance to corrosion, extending the lifespan of components in harsh conditions.

Applications of Molybdenum Copper Series
• Electronics: Used in heat sinks, substrates, and semiconductor bases to manage heat and improve device reliability.

• Aerospace: Employed in components that require high strength and thermal stability, such as rocket nozzles and heat shields.

• Power Generation: Utilized in electrical contacts and conductors due to their excellent electrical and thermal properties.

• Medical Devices: Applied in medical equipment where reliable thermal management is essential.

Why Choose Molybdenum Copper Alloys?
Choosing molybdenum copper alloys for your industrial applications ensures that you benefit from their unique combination of properties. Whether you need materials that can handle high temperatures, provide efficient electrical conductivity, or offer robust mechanical performance, the Molybdenum Copper Series delivers unmatched reliability and efficiency.

Explore the potential of molybdenum copper alloys and discover how they can enhance the performance and longevity of your products.

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