ASP3 1B02 2U server CPU air cooler view 2

ASP3 1B02 2U server CPU air cooler view 3

ASP3-1B02 2U Server CPU Heatsink | AMD SP3, 280 W

ASP3-1B02 is a 2U passive CPU heatsink for AMD SP3 processors, rated for a 280 W thermal load. Heat-pipe construction — copper base, aluminium fins, heat pipes — 117 × 78.9 × 64 mm overall, 4 heat pipes.

280 W rated — AMD EPYC 7002 / 7003 (SP3)
117 × 78.9 × 64 mm — 64 mm profile for 2U chassis
Copper base, aluminium fins, heat pipes — 4 heat pipes
Passive heatsink — for chassis-ducted airflow; no fan power required

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Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 280 W in a 2U chassis with front-to-back airflow. Fin thickness 0.4 mm, fin spacing 2.24 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper base, aluminium fins, heat pipes.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 117 × 78.9 × 64 mm; retention hardware for AMD SP3 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

ASP3-1B02 Specifications

Parameter	Value
Model	ASP3-1B02
Product type	2U server passive CPU heatsink
Socket / platform	AMD SP3 — AMD EPYC 7002 / 7003 (SP3)
Rated thermal load (TDP)	280 W
Overall size (L × W × H)	117 × 78.9 × 64 mm
Base / fin material	Copper base, aluminium fins, heat pipes
Heat pipes	4 PCS
Fin thickness	0.4 mm
Fin spacing	2.24 mm
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model ASP3-1B02 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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ASP3-1B01 1U Server CPU Heatsink | AMD SP3, 205 W

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