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ToneCooling Integrated Heat Dissipation Modules thermal management
ToneCooling Optimize High Power Chip Performance with Integrated Heat Dissipation Modules thermal management
ToneCooling Heat Dissipation Modules thermal management
ToneCooling Integrated Heat Dissipation Modules thermal management
ToneCooling Optimize High Power Chip Performance with Integrated Heat Dissipation Modules thermal management
ToneCooling Heat Dissipation Modules thermal management

Optimize Chip Performance with Heat Dissipation Modules

  • AIO(All-In-One) structure is more suitable for modular management of server.
  • Non-tube means leakage risk considerably reduces and the less evapotranspiration to be a long life.
  • NLP  (Non-Leaking Point) Tech: Few manual assembled and mature brazing process guarantees zero leakage.
  • Liquid cooling solution for compact server case.
Products Categories
Heat Sink
Tubed Cold Plates
CPU GPU Cold Plate
Vapor Chamber
Special-shaped Temperature Balancing Plates
Solar Type 3D Vapor Chamber
Temperature plate VC
Coolserver
TC-BGA 2518
TC-LGA 7529
TC-LGA 9324
TC-LGA 4189
TC-LGA 4677/4710
TC-LGA 1700/1851
LGA 3647 Narrow
TC-LGA 3647 Square
TC-LGA 2011 Narrow
TC-LGA 2066/2011 Square
TC-LGA 115X/1200
AMD SP7 Series
AMD SP6 Series
AMD SP5 Series
AMD SP3 Series
AMD AM5 Series
AMD AM4 Series
Tungsten Copper Alloy
Friction Stir Welded (FSW) liquid cold plate
Vacuum Brazed Liquid Cold Plate
AIO COOLER RADIATOR
CPU Cold Plate
GPU Cold Plate
IGBT cold plate
MOS Cold Plate
Battery Cold Plate
Other Liquid Cooling Solutions
3D Vapor Chamber​
Sever Optical Module
Battery Swapping Stations or Semiconductor Testing Equipments
Laser Projection
Liquid Cold Plate
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Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Description

1. Efficient Heat Transfer: These modules use advanced materials and designs to effectively dissipate heat from high-power chips, ensuring stable and efficient operation

2. Compact Design: The modules are designed to be compact, making them suitable for integration into various electronic devices without adding significant bulk

3. Enhanced Reliability: By maintaining optimal temperatures, these modules help extend the lifespan of electronic components and reduce the risk of thermal-related failures

4. Low Maintenance: The integrated design minimizes the need for regular maintenance, providing a hassle-free cooling solution

5. Noise Reduction: These modules often incorporate silent operation features, making them ideal for noise-sensitive environments

6. Scalability: They can be used in a wide range of applications, from consumer electronics to industrial machinery, due to their versatile design

Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Data Sheet

PumpModelA2
Voltage12V
Speed4000RPM
RadiatorDimensions317.5×108.5×32.3mm
MaterialAluminum
FanDimensions100x100x15m
Voltage12V
Speed3000RPM
Air flow(max)90.5CFM
Prerssure(max)2.1mm/H2O
Noise55dBA
Quantity3Pcs

Optimize High Power Chip Performance with Integrated Heat Dissipation Modules Applications

1. Power Electronics: These modules are essential in power electronics applications, where they help manage the significant heat output from high-power devices, ensuring stable and efficient operation

2. Data Centers: In data centers, they maintain optimal temperatures for servers and other critical infrastructure, reducing the risk of overheating and improving energy efficiency

3. Consumer Electronics: Integrated heat dissipation modules are used in devices like smartphones, laptops, and gaming consoles to keep them cool and enhance their performance and longevity

4. Automotive Industry: These modules are crucial in electric vehicles and other automotive applications, where they help manage the heat generated by high-power electronic components

5. Industrial Applications: In industrial settings, they provide reliable cooling for machinery and electronic components, enhancing their durability and performance in harsh environments

Integrated Heat Dissipation Modules are engineered to optimize the performance of high-power chips by efficiently dissipating heat. These compact and reliable modules use advanced materials and designs to ensure stable operation and extend the lifespan of electronic components. Ideal for applications in power electronics, data centers, consumer electronics, automotive industry, and industrial settings, they provide a low-maintenance and noise-reducing cooling solution that enhances the durability and performance of high-power devices.

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

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