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ToneCooling TC-LGA2011-2U3CC-CPU-Cooler server rack thermal management
ToneCooling LGA2011-2U3CC CPU Cooler thermal management
ToneCooling TC-LGA2011-2U3CC-CPU-Cooler server rack thermal management
ToneCooling LGA2011-2U3CC CPU Cooler thermal management

TC-LGA2011-2U3CC: High-Performance Xeon Cooler

The TC-LGA2011-2U3CC CPU Cooler is a powerful and efficient thermal solution engineered for Intel® Xeon® processors on the LGA 2011 socket platform. Optimized for 2U rackmount servers, this cooler is designed to handle high processing loads with consistent cooling performance. Featuring an advanced copper core design and a high-flow PWM fan, it delivers excellent heat dissipation while supporting 24/7 operation in enterprise and data center environments.

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Key Features

  • Intel LGA 2011 Compatibility
    Fully supports Intel® Xeon® E5 series processors and other LGA 2011 socket CPUs, making it ideal for professional server-grade systems.

  • 2U Rackmount Optimization
    Designed to fit 2U server chassis, providing a balanced combination of low profile and enhanced thermal capacity—perfect for dense yet high-performance server deployments.

  • Dual Copper Core Design
    Equipped with dual copper cores to maximize thermal conductivity and ensure rapid and efficient heat transfer from the CPU to the heatsink fins.

  • PWM-Controlled High-Speed Fan
    Features a powerful fan with PWM (Pulse Width Modulation) support, enabling dynamic speed adjustments based on system temperature for optimal cooling and noise control.

  • Durable Build for 24/7 Operation
    Built with robust materials and an easy-to-install mounting system, it’s engineered for consistent contact pressure and stable performance under continuous workloads.

TC-LGA2011-2U3CC Technical

  • Product model: TC-LGA2011-2U3CC
  • CPU type: TC-LGA2011 (square motherboard)
  • Voltage: 12V
  • Product size: 90mm*90mm*48mm
  • Fan speed: PWM 1700-4300RPM
  • Noise value: 37.00dBA (MAX)
  • Air volume: 32.49CFM (MAX)
  • Fan plug: 4pin PWM
  • Bearing type: double ball bearing
  • CPU hole distance: 80mm*80mm
  • Power consumption: 95W
  • Material: copper base + copper fins

Application Fields

1. 2U Rackmount Enterprise Servers

Perfect for enterprise-grade applications running on 2U rack servers, such as database management, virtualization platforms, file servers, and backend systems.

2. Data Centers and Cloud Infrastructure

A reliable choice for high-density data center deployments where uptime, performance, and efficient thermal management are vital for cloud computing, SaaS, and IaaS environments.

3. AI, HPC, and Technical Computing

Suitable for high-performance computing (HPC), artificial intelligence workloads, and technical simulations where processors run at maximum capacity for extended periods.

4. Edge Computing and Regional Data Hubs

Effective in distributed edge environments or micro data centers where 2U systems are deployed and consistent thermal efficiency is necessary to prevent overheating.

TC-LGA2011-2U3CC CPU Cooler: High-Performance Thermal Solution for 2U Intel® Xeon® Server Systems

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

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