LGA2011 5Z09 2U server CPU air cooler view 2

LGA2011 5Z09 2U server CPU air cooler view 3

LGA2011-5Z09 2U Server CPU Air Cooler | Intel LGA2011, 110 W

LGA2011-5Z09 is a 2U CPU air cooler for Intel LGA2011 processors, rated for a 110 W thermal load. Solid-metal construction — copper — 90 × 90 × 48 mm overall, PWM fan (PWM 1700-4300RPM). Mounting hole pitch 80 x 80 mm.

110 W rated — Intel Xeon E5 v3 / v4 (LGA2011-3)
90 × 90 × 48 mm — 48 mm profile for 2U chassis
Copper
PWM fan, 1700-4300RPM — double ball bearings, 12 V

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Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 110 W in a 2U chassis with front-to-back airflow. Fin thickness —, fin spacing —; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Fan: PWM 1700-4300RPM, 4-pin PWM, Double Ball Bearings, 12 V — speed follows the board fan curve.
Mechanical: 90 × 90 × 48 mm; mounting hole pitch 80 x 80 mm; retention hardware for Intel LGA2011 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA2011-5Z09 Specifications

Parameter	Value
Model	LGA2011-5Z09
Product type	2U server CPU air cooler
Socket / platform	LGA2011 (square ILM) — Intel Xeon E5 v3 / v4 (LGA2011-3)
Rated thermal load (TDP)	110 W
Overall size (L × W × H)	90 × 90 × 48 mm
Mounting hole pitch	80 x 80 mm
Base / fin material	Copper
Fan speed	PWM 1700-4300RPM
Rated voltage	12 V
Bearing	Double Ball Bearings
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model LGA2011-5Z09 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related products

LGA2011-5Z05 1U Server CPU Air Cooler | Intel LGA2011, 85 W

LGA2011-5Z03 1U Server CPU Air Cooler | Intel LGA2011, 95 W

LGA2011-5Z07 2U Server CPU Air Cooler | Intel LGA2011, 110 W

LGA2011-5B01 1U Server CPU Heatsink | Intel LGA2011, 95 W

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