This low-profile LGA4189 CPU cooler is designed for Intel Xeon processors, balancing a compact form factor with efficient cooling performance. It’s ideal for server environments where space is limited but reliable thermal management is crucial.
Key Features and Specifications:
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CPU Socket Type: LGA4189 (compatible with Intel Cooper Lake, Ice Lake Processors).
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Product Dimensions: 169mm * 154.5mm * 25mm.
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Power Consumption: Designed for CPUs with a TDP (Thermal Design Power) of up to 250W. Some coolers support up to 270W TDP.
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Fin Thickness: 0.3mm.
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Fin Spacing: 1.5mm.
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Material Composition: Copper base, aluminum fins, and 4 heat pipes. Some coolers utilize a copper vapor chamber base for enhanced heat dissipation.
Cooling Considerations:
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Active vs. Passive: Active coolers use a fan to dissipate heat, while passive coolers rely on heatsinks and natural convection.
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Form Factor: This cooler’s low profile makes it suitable for 1U, 2U, or 3U server chassis.
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Airflow: Sufficient chassis airflow is essential to maximize the cooler’s performance.
When selecting an LGA4189 CPU cooler, consider the specific thermal requirements of your CPU, the available space within the server chassis, and the desired noise level.
