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ToneCooling Liquid Cooling Modul thermal management
ToneCooling Opened-Loop Liquid Cooling Modul thermal management
ToneCooling Enhance Server Reliability with Opened-Loop Liquid Cooling Modul thermal management
ToneCooling Liquid Cooling Modul thermal management
ToneCooling Opened-Loop Liquid Cooling Modul thermal management
ToneCooling Enhance Server Reliability with Opened-Loop Liquid Cooling Modul thermal management

Enhance Server Reliability with Opened-Loop Liquid Cooling Modules

  • Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces.
  • Few manual assembled and mature all – copper friction brazing process to ensure zero leakage point,greatly reduce the evapotranspiration rate.
  • It is mainly used for server/Data center (it can meet 4677, 4189, 3647, TR4 and other standard platforms, and can be customized for non-standard platforms)
Products Categories
Heat Sink
Tubed Cold Plates
CPU GPU Cold Plate
Vapor Chamber
Special-shaped Temperature Balancing Plates
Solar Type 3D Vapor Chamber
Temperature plate VC
Coolserver
TC-BGA 2518
TC-LGA 7529
TC-LGA 9324
TC-LGA 4189
TC-LGA 4677/4710
TC-LGA 1700/1851
LGA 3647 Narrow
TC-LGA 3647 Square
TC-LGA 2011 Narrow
TC-LGA 2066/2011 Square
TC-LGA 115X/1200
AMD SP7 Series
AMD SP6 Series
AMD SP5 Series
AMD SP3 Series
AMD AM5 Series
AMD AM4 Series
Tungsten Copper Alloy
Friction Stir Welded (FSW) liquid cold plate
Vacuum Brazed Liquid Cold Plate
AIO COOLER RADIATOR
CPU Cold Plate
GPU Cold Plate
IGBT cold plate
MOS Cold Plate
Battery Cold Plate
Other Liquid Cooling Solutions
3D Vapor Chamber​
Sever Optical Module
Battery Swapping Stations or Semiconductor Testing Equipments
Laser Projection
Liquid Cold Plate
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Enhance Server Reliability with Opened-Loop Liquid Cooling Modules Description

1. Customizable Open-Loop Design: Allows for tailored cooling solutions to meet specific server requirements, providing flexibility and scalability
2. High Cooling Efficiency: Capable of handling significant thermal loads, ensuring optimal performance for high-power servers
3. Pure Copper Construction: Utilizes pure copper for excellent thermal conductivity and durability, enhancing heat transfer efficiency
4. Enhanced Heat Dissipation: The design maximizes surface area for heat exchange, ensuring efficient cooling even under heavy loads

Opened-Loop Liquid Cooling Modules Data Sheet

Tube

 

 

Dimensions

Material

 

Φ 10x400mm

FEP

 

Power dissipation

 

200~2000w

 

 

Opened-Loop Liquid Cooling Modules Applications

1. Data Centers: Ensures stable and efficient cooling for high-density server racks, reducing the risk of overheating and improving overall reliability
2. High-Performance Computing (HPC): Supports the cooling needs of powerful servers used in scientific research, simulations, and complex computations
3. Cloud Computing: Enhances the reliability and efficiency of servers that provide cloud services, ensuring minimal downtime and consistent performance
4. Enterprise IT Infrastructure: Improves the thermal management of servers in corporate data centers, supporting business-critical applications and services

Our advantages

Boost the reliability and efficiency of your servers with opened-loop liquid cooling modules. These advanced cooling solutions provide effective thermal management, ensuring optimal performance even in high-density data centers and demanding computing environments. Perfect for data centers, high-performance computing, cloud services, and telecommunications, opened-loop liquid cooling modules help maintain consistent operation and extend the lifespan of your servers. Experience enhanced reliability and efficiency with cutting-edge cooling technology.

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

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