High-Perf TC-LGA4189 Low-Profile Server CPU Cooler

This low-profile TC-LGA4189 CPU cooler is designed for Intel Xeon processors, balancing a compact form factor with efficient cooling performance. It’s ideal for server environments where space is limited but reliable thermal management is crucial.

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Key Technologies

14mm ultra-slim design, compatible with 1U (43mm) chassis space
Dual reflow-soldered copper base + 3D vapor chamber for full TC-LGA4189 contact coverage
Turbocharged oblique-flow fan with 35% higher static pressure
Intelligent PWM thermal control, IPMI remote management support

Key Features and Specifications:

CPU Socket Type: TC-LGA4189 (compatible with Intel Cooper Lake, Ice Lake Processors).
Product Dimensions: 169mm * 154.5mm * 25mm.
Power Consumption: Designed for CPUs with a TDP (Thermal Design Power) of up to 250W. Some coolers support up to 270W TDP.
Fin Thickness: 0.3mm.
Fin Spacing: 1.5mm.
Material Composition: Copper base, aluminum fins, and 4 heat pipes. Some coolers utilize a copper vapor chamber base for enhanced heat dissipation.

Designed for space-constrained, high-density server environments, the High-Perf LGA4189 Low-Profile CPU Cooler delivers exceptional thermal performance in a compact form factor, proving indispensable across these critical applications:

Hyper-Converged Infrastructure (HCI) Nodes
Optimized for 1U/2U rack servers, it ensures efficient cooling for platforms like VMware vSAN and Nutanix, stabilizing multi-node clusters under high-concurrency virtualization workloads within limited space.
Edge Computing & 5G Network Equipment
Provides silent cooling for edge data centers, 5G Multi-Access Edge Computing (MEC) servers, and O-RAN units, adapting to cramped telecom cabinets or industrial sites with operating temperatures ranging from -10°C to 50°C.
High-Performance Computing (HPC) Clusters
Supports Intel Xeon Ice Lake SP processors for intensive workloads like fluid dynamics simulations and genome sequencing. Its vapor chamber + micro heat pipe technology precisely controls CPU temperatures to prevent computational interruptions.
Financial High-Frequency Trading (HFT) Servers
Delivers 400W TDP cooling in 1U chassis, ensuring sustained full-frequency operation for low-latency trading systems. The maglev fan (≤25 dB(A)) eliminates noise interference in acoustically sensitive trading floors.
Medical Imaging & AI Diagnostics
Cools PACS (Picture Archiving and Communication System) servers and AI diagnostic platforms, complying with IEC 60601 medical noise standards (<30 dB(A)) and meeting sterile, quiet requirements in hospital data rooms.

Cooling Considerations:

Active vs. Passive: Active coolers use a fan to dissipate heat, while passive coolers rely on heatsinks and natural convection.
Form Factor: This cooler’s low profile makes it suitable for 1U, 2U, or 3U server chassis.
Airflow: Sufficient chassis airflow is essential to maximize the cooler’s performance.

When selecting an TC-LGA4189 CPU cooler, consider the specific thermal requirements of your CPU, the available space within the server chassis, and the desired noise level.

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