LGA4189 2B02 2U server CPU air cooler view 2

LGA4189 2B02 2U server CPU air cooler view 3

LGA4189-2B02 2U Server CPU Heatsink | Intel LGA4189, 300 W

LGA4189-2B02 is a 2U passive CPU heatsink for Intel LGA4189 processors, rated for a 300 W thermal load. Heat-pipe construction — copper base, aluminium fins, heat pipes — 113 × 78 × 64.5 mm overall, 5 heat pipes.

300 W rated — 3rd Gen Intel Xeon Scalable (Ice Lake-SP / Cooper Lake)
113 × 78 × 64.5 mm — 64.5 mm profile for 2U chassis
Copper base, aluminium fins, heat pipes — 5 heat pipes, 72 x 54 mm copper base
Passive heatsink — for chassis-ducted airflow; no fan power required

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Engineering overview

Thermal: rated 300 W in a 2U chassis with front-to-back airflow. Fin thickness 0.35 mm, fin spacing 1.65 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: 72 x 54 mm copper contact plate with 5 sintered heat pipes spreading into the fin stack.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 113 × 78 × 64.5 mm; retention hardware for Intel LGA4189 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA4189-2B02 Specifications

Parameter	Value
Model	LGA4189-2B02
Product type	2U server passive CPU heatsink
Socket / platform	Intel LGA4189 — 3rd Gen Intel Xeon Scalable (Ice Lake-SP / Cooper Lake)
Rated thermal load (TDP)	300 W
Overall size (L × W × H)	113 × 78 × 64.5 mm
Base / fin material	Copper base, aluminium fins, heat pipes
Heat pipes	5 PCS
Copper base plate	72 x 54 mm
Fin thickness	0.35 mm
Fin spacing	1.65 mm
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

2U rack servers and hyper-converged nodes
GPU and storage servers
Server OEM and ODM programmes

Ordering & RFQ

How to order: quote model LGA4189-2B02 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.