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ToneCooling 2U-LGA4189-Cooler-300W server rack thermal management
2U-LGA4189-Cooler-300W-TDP-Vapor-Chamber
ToneCooling 2U-LGA4189-Cooler-300W server rack thermal management
2U-LGA4189-Cooler-300W-TDP-Vapor-Chamber

2U TC-LGA4189 Vapor Chamber Cooler | 300W TDP

Active 2U vapor chamber CPU cooler for 3rd Gen Intel Xeon Scalable processors on the LGA4189 socket, rated up to 300 W TDP, with a copper vapor chamber base, five heat pipes, aluminum fins and a 2,100–8,000 RPM PWM fan.

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2U TC-LGA4189 Vapor Chamber CPU Cooler, 300 W TDP, High-Speed PWM Fan

Design

  • Copper vapor chamber base spreads heat from the CPU across the whole base, reducing hot spots before the heat reaches the heat pipes.
  • Five heat pipes carry heat from the vapor chamber into the fin stack.
  • Aluminum fins sized for 2U and taller chassis.
  • High-speed 4-pin PWM fan: 2,100–8,000 RPM, up to 34.74 CFM, 54.34 dBA maximum, double ball bearing, 12 V.

Why a Vapor Chamber Base?

A vapor chamber is a flat, sealed copper chamber with an internal wick and a small charge of working fluid. The fluid evaporates over the hot CPU area and condenses across the rest of the chamber, so heat spreads in two dimensions much faster than through solid copper. On a large LGA4189 package this keeps the base temperature more uniform and lets all five heat pipes share the load.

Fit

  • Socket: Intel LGA4189 (3rd Gen Xeon Scalable).
  • Rated CPU TDP: up to 300 W.
  • Server height: 2U and up.
  • Reference dimensions: 113 × 80 × 66.3 mm (confirm with the drawing).

Rated TDP is a reference value. Actual cooling depends on chassis airflow, inlet air temperature and TIM; confirm with your system conditions.

Key Features and Specifications

  • CPU Socket Type: TC-LGA4189, compatible with Intel Xeon processors.

  • Form Factor: Recommended for 2U Server and up.

  • Voltage: 12V.

  • Product Dimensions: 113mm * 80mm * 66.3mm (estimated)..

  • Power Consumption: Supports CPUs with a TDP up to 300W.

  • Material Composition: Copper vapor chamber base, 5 heat pipes and aluminum fins.

  • Cooling Type: Active, with a PWM-controlled fan.

  • Fan Speed: PWM 2100-8000RPM.

  • Noise Level: 54.34dBA (MAX).

  • Air Volume: 34.74CFM (MAX).

  • Fan Connector: 4pin PWM.

  • Bearing Type: Double ball.

Industry Applications

  • 2U rack servers and compute nodes on 3rd Gen Xeon Scalable platforms
  • High-TDP Xeon configurations up to 300 W where a stronger fan is acceptable
  • Storage and network appliances with 2U or taller chassis

Last Updated: 2026-10-03 | Author: ToneCooling Thermal Engineering Team

This 2U TC-LGA4189 vapor chamber cooler is an active air cooler for 3rd Gen Intel Xeon Scalable processors on the LGA4189 socket, rated for CPUs up to 300 W TDP in 2U and taller servers. It combines a copper vapor chamber base with five heat pipes, aluminum fins and a high-speed 2,100–8,000 RPM PWM fan.

Why a Vapor Chamber Base

A vapor chamber is a flat, sealed copper chamber with an internal wick and a small charge of working fluid. The fluid evaporates over the hot CPU area and condenses across the rest of the chamber, so heat spreads in two dimensions much faster than through solid copper. On a large LGA4189 package this keeps the base temperature more uniform and lets all five heat pipes share the load.

How to Check the Fit

  • Socket: Intel LGA4189 only. LGA4677, LGA7529 and AMD SP3/SP5 servers use different ToneCooling models.
  • Server height: 2U and up; reference dimensions 113 × 80 × 66.3 mm (confirm with the drawing). For 1U servers, see the TC-LGA4189 1U Server Cooler; for help choosing, see the LGA4189 server CPU cooler selection guide.
  • Airflow and noise: up to 34.74 CFM at a maximum of 54.34 dBA; plan chassis acoustics accordingly.
  • TDP margin: 300 W is the rated CPU TDP. Actual cooling depends on chassis airflow, inlet air temperature and TIM; confirm with your system conditions.

Vapor Chamber or Heat Pipe Version?

ToneCooling offers two 2U LGA4189 coolers rated for 300 W TDP. Choose this vapor chamber version when the CPU runs near full TDP for long periods or chassis airflow is limited, since the vapor chamber spreads heat more evenly across the base and the fan reaches 8,000 RPM. Choose the 2U LGA4189 heat pipe cooler (copper base, five heat pipes, 113 × 78 × 64.5 mm) when chassis airflow is strong and the CPU has thermal margin.

Need a different height, fin stack or mounting? Send your chassis drawing and CPU TDP. Custom samples are available from a single piece and typically take 4–6 weeks. An engineer reviews every RFQ and replies by email with next steps.

Frequently Asked Questions

What CPU sockets does this 2U LGA4189 cooler support?

Intel LGA4189 only, for 3rd Gen Xeon Scalable processors. For LGA4677, LGA7529 or AMD SP3/SP5 servers, ToneCooling offers separate models.

What is the difference between this cooler and the 2U heat pipe version?

This version adds a copper vapor chamber base and a high-speed 2,100–8,000 RPM fan; the heat pipe version uses a solid copper base with five heat pipes. Both are rated for 300 W TDP on LGA4189. Send your CPU, airflow and noise targets and an engineer will recommend one.

Can I order a single custom sample?

Yes. Custom samples are available from a single piece and typically take 4–6 weeks. An engineer reviews every RFQ and replies by email with next steps.

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