LGA4189 2B07 1U server CPU air cooler view 2

LGA4189 2B07 1U server CPU air cooler view 3

LGA4189-2B07 1U Server CPU Heatsink | Intel LGA4189, 230 W

LGA4189-2B07 is a 1U passive CPU heatsink for Intel LGA4189 processors, rated for a 230 W thermal load. Vapor-chamber construction — vapor chamber base, aluminium fins — 113 × 78 × 25 mm overall.

230 W rated — 3rd Gen Intel Xeon Scalable (Ice Lake-SP / Cooper Lake)
113 × 78 × 25 mm — 25 mm profile for 1U chassis
Vapor chamber base, aluminium fins
Passive heatsink — for chassis-ducted airflow; no fan power required

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: rated 230 W in a 1U chassis with front-to-back airflow. Fin thickness 0.3 mm, fin spacing 1.5 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Vapor chamber base, aluminium fins.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 113 × 78 × 25 mm; retention hardware for Intel LGA4189 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA4189-2B07 Specifications

Parameter	Value
Model	LGA4189-2B07
Product type	1U server passive CPU heatsink
Socket / platform	LGA4189 (narrow ILM) — 3rd Gen Intel Xeon Scalable (Ice Lake-SP / Cooper Lake)
Rated thermal load (TDP)	230 W
Overall size (L × W × H)	113 × 78 × 25 mm
Base / fin material	Vapor chamber base, aluminium fins
Fin thickness	0.3 mm
Fin spacing	1.5 mm
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA4189-2B07 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.