The optimal TC-LGA4189 CPU cooler depends on the server’s specific cooling requirements and operating environment. When selecting an TC-LGA4189 CPU cooler, consider the thermal requirements of your CPU, the available space within the server chassis, and the desired noise level.
High-Efficiency TC-LGA4189 VC Heatsink For 1U/2U Servers
This compact TC-LGA4189 CPU cooler leverages vapor chamber (VC) technology to provide efficient cooling for Intel Xeon processors. It’s designed for space-constrained server environments requiring reliable thermal management.
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Cooling Performance and Design:
This cooler combines a VC soaking plate with aluminum fins. The VC technology enhances heat transfer, while the aluminum fins provide a large surface area for heat dissipation. Some coolers utilize a copper vapor chamber base for enhanced heat dissipation. The 3D-VC heat sink combines VC and heat pipes to connect the internal cavity and achieve refrigerant reflux through a capillary structure, completing heat conduction.
Key Features and Specifications:
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CPU Socket Type: TC-LGA4189, compatible with Intel Xeon processors (Ice Lake and Cooper Lake).
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Product Dimensions: 113mm * 78mm * 25mm. Note that this size is suitable for 1U and 2U server chassis.
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Power Consumption: Supports CPUs with a TDP up to 230W. Some coolers support up to 205W or 270W TDP.
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Material Composition: VC soaking plate and aluminum fins. Some coolers utilize a copper base, aluminum fins, and heat pipes.
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Fin Thickness: 0.3mm.
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Fin Spacing: 1.5mm.
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Cooling Type: Passive or Active (with fan).
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Fan Speed: (If active) PWM controlled.
Alternative Cooling Methods & Considerations:
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Server Form Factor: Designed for 1U and 2U servers, ensuring compatibility with space constraints.
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Active vs. Passive: Active coolers use a fan to dissipate heat, while passive coolers rely on heatsinks and natural convection.
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3D-VC heat sinks: Utilize a combination of VC and heat pipes to connect the internal cavity and achieve refrigerant reflux through a capillary structure, completing heat conduction. The multi-dimensional cooling path allows 3D-VC heat sinks to come into contact with more heat sources and provide more heat dissipation paths when dealing with high power devices.
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Airflow: Adequate chassis airflow is crucial to maximize cooling performance. Dynatron N6 Cooler with aluminum stacked fins with heat pipes directly contacting CPU suitable for cooling Intel Socket TC-LGA 4189-4/5 (Socket P4/P5 or P+) motherboards in a 3U Chassis.
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Noctua options: Noctua offers CPU coolers for Intel’s TC-LGA4189 Xeon platform. The latest revision for TC-LGA4189 comprises 14, 12 and two 9cm models, covering anything from spacious workstation cases to 4U rack-mount servers.
