1. High Efficiency: These modules use a dual-channel liquid cooling system to effectively dissipate heat from two CPUs, ensuring consistent and efficient cooling
2. Compact 2U Form Factor: The 2U rackmount design allows for high-density installations, making them suitable for data centers and other space-constrained environments
3. Support for High TDP CPUs: These modules can handle CPUs with high Thermal Design Power (TDP), making them ideal for high-performance computing tasks
4. Enhanced Memory Capacity: They support a large number of DIMM slots, allowing for significant memory expansion, which is crucial for demanding applications
5. Low Maintenance: The closed-loop design minimizes the need for regular maintenance and reduces the risk of leaks
6. Quiet Operation: By efficiently managing heat, these modules help maintain a quieter operating environment, which is beneficial for noise-sensitive applications
| Radiator | Dimensions | 435x86x71mm | |
| Material | Aluminum | ||
| Tube | Dimensions | Φ13x400mm | |
| Material | EPDM | ||
| Fan | Dimensions | 80x80x38mm | |
| Voltage | 12V | ||
| Speed | 8000RPM | ||
| Air flow(max) | 85.5CFM | ||
| Prerssure(max) | 45.23mm/H2O | ||
| Noise | 68.5dBA | ||
| Quantity | 4Pcs | ||
| Power dissipation | 600w | ||
1. Data Centers: These modules are ideal for data centers where efficient cooling is crucial for maintaining the performance and reliability of servers running continuously
2. High-Performance Computing (HPC): In HPC environments, these cooling modules help manage the significant heat output from powerful CPUs, ensuring stable and optimal performance for complex computations
3. Enterprise Servers: For enterprise applications, these modules support high-density installations and can handle CPUs with high Thermal Design Power (TDP), making them suitable for intensive workloads
4. Scientific Research: Used in research labs, these cooling systems support the high computational demands of scientific simulations and data analysis
5. Industrial Applications: In industrial settings, these modules provide reliable cooling for machinery and electronic components, enhancing their durability and performance in harsh environments
Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.
✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available
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