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ToneCooling 1UF71-P (EAVC) CPU Cooler thermal management
ToneCooling TC-4677-1UF71-P (EAVC) CPU Cooler thermal management
ToneCooling 1UF71-P (EAVC) CPU Cooler thermal management
ToneCooling TC-4677-1UF71-P (EAVC) CPU Cooler thermal management

TC-4677-1UF71-P (EAVC) CPU Cooler: Compact 1U Thermal Solution for Intel LGA4677 Platforms

The TC-4677-1UF71-P (EAVC) CPU cooler is a purpose-built thermal solution optimized for Intel LGA4677 processors used in 4th and 5th Gen Xeon Scalable platforms (Sapphire Rapids / Emerald Rapids). Designed specifically for 1U rackmount servers, it delivers effective heat dissipation for CPUs with TDPs up to 300W, while maintaining the strict space and airflow limitations of modern data center hardware.

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Key Thermal Features

A. Solid Copper Base with Direct Contact

  • CNC-machined pure copper baseplate ensures rapid heat absorption

  • Full IHS coverage of Xeon SP processors for optimal thermal transfer

  • TIM-ready surface with pre-applied phase-change material for hassle-free installation

B. High-Efficiency Heatpipe Array

  • Integrated 6× Ø6mm copper heatpipes

  • Sintered wick structure supports high thermal conductivity under all mounting orientations

  • Heatpipes are flattened and embedded for 1U clearance optimization

C. Optimized Fin Stack Design

  • Densely packed aluminum fin array engineered for high-velocity airflow

  • Surface area maximized within 1U envelope to support TDPs up to 300W

  • Fin-to-heatpipe bonding with solder for reduced thermal resistance

TC-4677-1UF71-P (EAVC) Technical

Product model: TC-4677-1UF71-P (EAVC)

CPU type: TC-LGA4677

Product size: 162.25mm*159.2mm*25mm

Power consumption: 300W

Fin thickness: 0.3mm

Fin spacing: 1.5mm

Material: Copper base + aluminum fins + 6 heat pipes

Primary Applications

  • AI and machine learning inference nodes

  • Cloud infrastructure and virtualization hosts

  • High-density 1U compute servers

  • Enterprise and telecom-grade edge deployments

Mechanical Design & Integration

  • Total cooler height: 42mm, fully compatible with standard 1U rackmount enclosures

  • Tool-free mounting brackets for quick and secure installation

  • Compliant with Intel thermal/mechanical guidelines for LGA4677 platforms

Dimensions:

  • Height: 42mm

  • Width/Depth: 94mm x 94mm

  • Weight: ~520g

  • Connector: 4-pin PWM

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

✓ ISO 9001 Certified  |  ✓ MOQ 5 pcs  |  ✓ Prototype in 4–6 weeks  |  ✓ NDA Available

Need a Custom Liquid Cold Plate?

Tell us your thermal requirements. Engineering team responds within 48 hours with design proposal and quotation.

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MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified

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