ToneCooling TC-4677-1UF72-P (EAVC) CPU Cooler thermal management

ToneCooling 1UF72-P (EAVC) CPU Cooler thermal management

TC-4677-1UF72-P (EAVC) CPU Cooler: High-Efficiency 1U Thermal Solution for Intel LGA4677 Xeon Scalable Processors

The TC-4677-1UF72-P (EAVC) is a high-performance 1U CPU cooler designed specifically for Intel® LGA4677 socket processors, including the 4th and 5th Gen Xeon Scalable (Sapphire Rapids and Emerald Rapids) platforms. Built for data centers, AI clusters, and hyperscale servers, it enables effective cooling of CPUs with TDP ratings up to 350W+ within the strict height constraints of a 1U rack chassis.

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Thermal Design & Technology Highlights

A. Vapor Chamber Cold Plate

Integrated high-efficiency copper vapor chamber base
Rapid thermal equalization across large die CPUs
Supports full IHS coverage for Sapphire Rapids CPUs

B. Optimized Heatpipe Layout

Equipped with 6× Ø6mm sintered copper heatpipes
Flattened U-shape layout for optimal heat transport to fin stack
Orientation supports vertical and horizontal server mounting

C. High-Density Fin Array

72-fin stack with tight fin pitch for forced-air 1U airflow
Total surface area maximized within 1U height constraint
Aluminum fins soldered to heatpipes for minimal thermal resistance

TC-4677-1UF72-P (EAVC) Technical

Product model: TC-4677-1UF72-P (EAVC)

CPU type: TC-LGA4677

Product size: 169mm*157.3mm*25mm

Power consumption: 250W

Fin thickness: 0.3mm

Fin spacing: 1.5mm

Material: Copper base + aluminum fins + 4 heat pipes

Target Use Cases

1U high-density servers
AI inference and training nodes
Cloud and hyperscale data centers
Edge computing with HPC requirements

Mechanical Design & Installation

Designed to fit standard 1U server chassis (43mm max height)
Pre-applied phase-change thermal interface material (TIM) ensures optimal thermal contact
Tool-free mounting brackets designed for Intel server board retention modules

Dimensions: