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Optimized VC Temperature Plate for Consistent Temperature Maintenance
Durable VC Temperature Plate for Industrial and Laboratory Use
Optimize Thermal Management with Temperature Plate: Advanced Cooling Solutions for High-Performance Systems
Optimized VC Temperature Plate for Consistent Temperature Maintenance
Durable VC Temperature Plate for Industrial and Laboratory Use
Optimize Thermal Management with Temperature Plate: Advanced Cooling Solutions for High-Performance Systems

Temperature Plate VC-110-92-6

 VC welding process

Welding process  Diffusion welding  Copper solder paste welding

Features

  • Service life 15 years; high cost; high fixture cost
  • Service life 10 years; low cost; low fixture cost

Application industries

  • Communications/databases/servers,
  • computers/mobile phones/consumer electronics
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Vapor Chamber Description

  1. High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
  2. Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
  3. Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
  4. Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
  5. High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
  6. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.

Vapor Chamber Technical/Data Sheet

Thickness of the temperature plate

  • Capillary structure should be equal to or greater than 1.6mm.
  • Sintered copper powder + copper powder ring + copper column ≥ 0.4mm
  • Sintered copper wire mesh with copper powder column ≤ 0.8mm
  • Sintered special copper powder ≤ 0.8mm
  • Sintered copper wire mesh combined with sintered special copper powder
Size 110 x 92 x 6
Power 200W
Thermal resistance 0.062
Heat source size 30*30
Application industry Graphics Card

Our company can process and customize various heat spreaders

Capillary wick structure Sintered copper powder, sintered copper wire mesh
Welding processes copper solder paste welding, diffusion welding;
Maximum siz 500 x 320 mm;
Maximum power 1500W;
Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders

Different working fluids and temperature ranges

Container/Working medium Operating temperature range Aging temperature
Copper/Water  +30°C ~ +120°C  +135°C
Copper/Methanol 40°C ~ +90°C  +100°C

Vapor Chamber Maximum Size and Power Reference Table

Thickness(mm) Maximum length (mm)  Maximum width(mm) Maximum thermal power (W)
3.0=<T<= 10 500  320 500W ~ 1500W
1.6-<T<3 320 150 130W ~ 500W
0.5=<T<=1.5 200    100 13W~ 130W
0.2-<T<= 0.4 120   60  3W~8W

Vapor Chamber Applications

  • Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
  • Telecommunications Applications: Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
  • Automotive Industry Applications: Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
  • Aerospace Applications: Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
Temperature Plate VC-110-92-6 Detail Display

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