·High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
·Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
·Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
·Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
·High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
·Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.
| Substrate size | Thermal Resistance | Power |
| 147*130*5.8 | 0.068 | 250W |
| Heat source dimensions | Industry | |
| 30*30 | AI Devices |
Our company can process and customize various heat spreaders.
| Capillary wick structure: | sintered copper powder, sintered copper wire mesh |
| Welding processes | copper solder paste welding, diffusion welding |
| Maximum size | 500 x 320 mm |
| Maximum power | 1500W |
Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders
VC capillary structure and thickness
Thickness of the temperature plate
Capillary structure should be equal to or greater than 1.6mm.
Sintered copper powder + copper powder ring + copper column ≥ 0.4mm
Sintered copper wire mesh with copper powder column ≤ 0.8mm
Sintered special copper powder ≤ 0.8mm
Sintered copper wire mesh combined with sintered special copper powder
VC welding process
| Welding process | Diffusion welding | Copper solder paste welding |
Features
| Service life 15 years | high cost | high fixture cost |
| Service life 10 years | low cost | low fixture cost |
Application industries
| Communications | databases | servers |
| computers | mobile phones | consumer electronics |
Different working fluids and temperature ranges
| Container/Working medium | Operating temperature range | Aging temperature |
| Copper/Water | +30°C ~ +120°C | +135°C |
| Copper/Methanol | 40°C ~ +90°C | +100°C |
Vapor Chamber Maximum Size and Power Reference Table
| Thickness(mm) | Maximum length (mm) | Maximum width(mm) | Maximum thermal power (W) |
| 3.0=<T<= 10 | 500 | 320 | 500W ~ 1500W |
| 1.6-<T<3 | 320 | 150 | 130W ~ 500W |
| 0.5=<T<=1.5 | 200 | 100 | 13W~ 130W |
| 0.2-<T<= 0.4 | 120 | 60 | 3W~8W |
1.Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
2.Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
3.Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
4.Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
Temperature plate VC-147-130-5.8
Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.
✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available
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