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Temperature plate VC front plane line drawing
Temperature plate VC front and back flat line drawing
Flat lay of golden Temperature plate VC on black swatch
Temperature plate VC front plane line drawing
Temperature plate VC front and back flat line drawing
Flat lay of golden Temperature plate VC on black swatch

Temperature plate VC-147-130-5.8

·High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
·Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
·Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
·Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
·High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
·Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.

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Vapor Chamber Technical/Data Sheet

Substrate size Thermal Resistance Power
147*130*5.8 0.068 250W
Heat source dimensions Industry
30*30 AI Devices

Our company can process and customize various heat spreaders.

Capillary wick structure: sintered copper powder, sintered copper wire mesh
Welding processes copper solder paste welding, diffusion welding
Maximum size 500 x 320 mm
Maximum power 1500W

Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders

 

VC capillary structure and thickness

Thickness of the temperature plate

Capillary structure should be equal to or greater than 1.6mm.

Sintered copper powder + copper powder ring + copper column ≥ 0.4mm

Sintered copper wire mesh with copper powder column ≤ 0.8mm

Sintered special copper powder ≤ 0.8mm

Sintered copper wire mesh combined with sintered special copper powder

 

VC welding process

Welding process Diffusion welding Copper solder paste welding

Features

Service life 15 years high cost high fixture cost
Service life 10 years low cost low fixture cost

Application industries

Communications databases servers
computers mobile phones consumer electronics

Different working fluids and temperature ranges

Container/Working medium Operating temperature range Aging temperature
Copper/Water +30°C ~ +120°C +135°C
Copper/Methanol 40°C ~ +90°C +100°C

Vapor Chamber Maximum Size and Power Reference Table

Thickness(mm)  Maximum length (mm) Maximum width(mm) Maximum thermal power (W)
3.0=<T<= 10 500 320 500W ~ 1500W
1.6-<T<3 320 150 130W ~ 500W
0.5=<T<=1.5 200 100 13W~ 130W
0.2-<T<= 0.4 120 60 3W~8W

1.Electronics and Computing Applications 2.Telecommunications Applications 3.Automotive Industry Applications 4.Aerospace Applications

1.Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
2.Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
3.Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
4.Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.

Temperature plate VC Detail Display

Temperature plate VC-147-130-5.8

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