Temperature Plate VC-90-90-3
VC welding process
Welding process Diffusion welding Copper solder paste welding
Features
- Service life 15 years; high cost; high fixture cost
- Service life 10 years; low cost; low fixture cost
Application industries
- Communications/databases/servers,
- computers/mobile phones/consumer electronics
Vapor Chamber Description
- High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
- Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
- Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
- Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
- High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
- Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.
Vapor Chamber Technical/Data Sheet
Thickness of the temperature plate
- Capillary structure should be equal to or greater than 1.6mm.
- Sintered copper powder + copper powder ring + copper column ≥ 0.4mm
- Sintered copper wire mesh with copper powder column ≤ 0.8mm
- Sintered special copper powder ≤ 0.8mm
- Sintered copper wire mesh combined with sintered special copper powder
| Size | 90*90*3 |
| Power | 150W |
| Thermal resistance | 0.07 |
| Heat source size | 30*30 |
| Application industry | Server |
| Size | 108 x 78 x 4.5 |
| Power | 210W |
| Thermal resistance | 0.062 |
| Heat source size | 30 x 30 |
| Application industry | Server |
Our company can process and customize various heat spreaders
| Capillary wick structure | Sintered copper powder, sintered copper wire mesh |
| Welding processes | copper solder paste welding, diffusion welding; |
| Maximum siz | 500 x 320 mm; |
| Maximum power | 1500W; |
| Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders | |
Different working fluids and temperature ranges
| Container/Working medium | Operating temperature range | Aging temperature |
| Copper/Water | +30°C ~ +120°C | +135°C |
| Copper/Methanol | 40°C ~ +90°C | +100°C |
Vapor Chamber Maximum Size and Power Reference Table
| Thickness(mm) | Maximum length (mm) | Maximum width(mm) | Maximum thermal power (W) |
| 3.0=<T<= 10 | 500 | 320 | 500W ~ 1500W |
| 1.6-<T<3 | 320 | 150 | 130W ~ 500W |
| 0.5=<T<=1.5 | 200 | 100 | 13W~ 130W |
| 0.2-<T<= 0.4 | 120 | 60 | 3W~8W |
Vapor Chamber Applications
- Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
- Telecommunications Applications: Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
- Automotive Industry Applications: Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
- Aerospace Applications: Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
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