Compact-Temperature-Plate-VC-for-Space-Constrained-Environments

Achieve Optimal Thermal Performance with Temperature Plate VC: Advanced Cooling Solutions for High-Density Electronics

Efficient-VC-Temperature-Plate-for-High-Performance-Applications

Temperature Plate VC-90-90-3

VC welding process

Welding process Diffusion welding Copper solder paste welding

Features

Service life 15 years; high cost; high fixture cost
Service life 10 years; low cost; low fixture cost

Application industries

Communications/databases/servers,
computers/mobile phones/consumer electronics

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Vapor Chamber Description

High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.

Vapor Chamber Technical/Data Sheet

Thickness of the temperature plate

Capillary structure should be equal to or greater than 1.6mm.
Sintered copper powder + copper powder ring + copper column ≥ 0.4mm
Sintered copper wire mesh with copper powder column ≤ 0.8mm
Sintered special copper powder ≤ 0.8mm
Sintered copper wire mesh combined with sintered special copper powder

Size	90903
Power	150W
Thermal resistance	0.07
Heat source size	30*30
Application industry	Server

Size	108 x 78 x 4.5
Power	210W
Thermal resistance	0.062
Heat source size	30 x 30
Application industry	Server

Our company can process and customize various heat spreaders

Capillary wick structure	Sintered copper powder, sintered copper wire mesh
Welding processes	copper solder paste welding, diffusion welding;
Maximum siz	500 x 320 mm;
Maximum power	1500W;
Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders

Different working fluids and temperature ranges

Container/Working medium	Operating temperature range	Aging temperature
Copper/Water	+30°C ~ +120°C	+135°C
Copper/Methanol	40°C ~ +90°C	+100°C

Vapor Chamber Maximum Size and Power Reference Table

Thickness(mm)	Maximum length (mm)	Maximum width(mm)	Maximum thermal power (W)
3.0=<T<= 10	500	320	500W ~ 1500W
1.6-<T<3	320	150	130W ~ 500W
0.5=<T<=1.5	200	100	13W~ 130W
0.2-<T<= 0.4	120	60	3W~8W

Vapor Chamber Applications

Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
Telecommunications Applications: Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
Automotive Industry Applications: Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
Aerospace Applications: Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.

Temperature Plate VC-90-90-3 Detail Display

High-Precision Temperature Control Plate VC for Exact Thermal Management

Need a Custom Cold Plate for Your Project?

Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

Request a Quote → WhatsApp Us

✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available

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