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Compact-Temperature-Plate-VC-for-Space-Constrained-Environments
Achieve Optimal Thermal Performance with Temperature Plate VC: Advanced Cooling Solutions for High-Density Electronics
Efficient-VC-Temperature-Plate-for-High-Performance-Applications
Compact-Temperature-Plate-VC-for-Space-Constrained-Environments
Achieve Optimal Thermal Performance with Temperature Plate VC: Advanced Cooling Solutions for High-Density Electronics
Efficient-VC-Temperature-Plate-for-High-Performance-Applications

Temperature Plate VC-90-90-3

VC welding process

Welding process  Diffusion welding  Copper solder paste welding

Features

  • Service life 15 years; high cost; high fixture cost
  • Service life 10 years; low cost; low fixture cost

Application industries

  • Communications/databases/servers,
  • computers/mobile phones/consumer electronics
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Vapor Chamber Description

  1. High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity.
  2. Uniform Heat Distribution: The design allows heat to quickly diffuse across the entire surface, reducing hotspots and ensuring stable device operation.
  3. Thin Profile: The compact structure of the Vapor Chamber, usually with a small thickness, makes it suitable for space-constrained applications.
  4. Noise-Free Operation: With no moving parts, it operates completely silently, ideal for applications requiring a quiet environment, like consumer electronics.
  5. High Reliability: The sealed structure ensures durability and long-term reliability, allowing stable performance in various harsh environments.
  6. Versatile Applications: Vapor Chambers can be combined with other cooling solutions, such as heat sinks and fans, to further enhance cooling performance.

Vapor Chamber Technical/Data Sheet

Thickness of the temperature plate

  • Capillary structure should be equal to or greater than 1.6mm.
  • Sintered copper powder + copper powder ring + copper column ≥ 0.4mm
  • Sintered copper wire mesh with copper powder column ≤ 0.8mm
  • Sintered special copper powder ≤ 0.8mm
  • Sintered copper wire mesh combined with sintered special copper powder
Size 90*90*3
Power 150W
Thermal resistance 0.07
Heat source size 30*30
Application industry Server
Size 108 x 78 x 4.5
Power 210W
Thermal resistance 0.062
Heat source size 30 x 30
Application industry Server

Our company can process and customize various heat spreaders

Capillary wick structure Sintered copper powder, sintered copper wire mesh
Welding processes copper solder paste welding, diffusion welding;
Maximum siz 500 x 320 mm;
Maximum power 1500W;
Able to design and manufacture copper/water normal temperature heat spreaders and copper/methanol low temperature heat spreaders

Different working fluids and temperature ranges

Container/Working medium Operating temperature range Aging temperature
Copper/Water  +30°C ~ +120°C  +135°C
Copper/Methanol 40°C ~ +90°C  +100°C

Vapor Chamber Maximum Size and Power Reference Table

Thickness(mm) Maximum length (mm)  Maximum width(mm) Maximum thermal power (W)
3.0=<T<= 10 500  320 500W ~ 1500W
1.6-<T<3 320 150 130W ~ 500W
0.5=<T<=1.5 200    100 13W~ 130W
0.2-<T<= 0.4 120   60  3W~8W

Vapor Chamber Applications

  • Electronics and Computing Applications: Used in high-performance computing systems, graphics cards, and other electronic devices to manage heat and prevent overheating.
  • Telecommunications Applications: Applied in telecom equipment and infrastructure to ensure reliable operation by efficiently dissipating heat.
  • Automotive Industry Applications: Integrated into electric and hybrid vehicles to cool power electronics, batteries, and other high-heat components.
  • Aerospace Applications: Employed in spacecraft and satellite systems for thermal management of sensitive electronics and components in extreme space environments.
Temperature Plate VC-90-90-3 Detail Display

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