ToneCooling LGA3647 CPU Cooler thermal management

ToneCooling Ultra-Compact LGA3647 CPU Cooler thermal management

Ultra-Compact TC-LGA3647 CPU Cooler | 350W TDP, 0.15mm Copper Fin Array

The LGA3647-W1 is a mission-critical CPU cooler designed for Intel® Xeon® Scalable Processors (LGA3647 socket), delivering 350W TDP cooling capacity in a slim 19.1mm profile. Featuring a revolutionary 0.15mm micro-fin copper architecture, it redefines thermal density for HPC clusters, enterprise servers, and AI inference systems.

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Core Advantages

1. Micron-level heat dissipation matrix
0.15mm ultra-thin copper fins: 58% increase in effective heat dissipation area compared to the traditional 0.3mm solution, and heat flux density increased to 120W/cm²;
Thermal plate auxiliary technology: vacuum brazing of copper bottom and fins, contact thermal resistance reduced by 22%, measured ΔT (temperature difference) ≤10℃@350W.
2. Extreme space optimization
19.1mm ultra-thin height: suitable for 1U/2U racks and customized edge computing devices;
Asymmetric air duct design: reduce airflow interference of PCIe cards at the rear of the server, and improve heat dissipation efficiency by 15%.
3. Industrial-grade durability
Copper anti-oxidation coating: passed the 96-hour salt spray test (ASTM B117), and the life was extended to 8 years+;
Wide voltage compatibility: supports 12V-48V DC input, suitable for telecommunications base stations and vehicle-mounted servers.

Technical Specifications

Model: LGA3647-W1
Socket Compatibility: Intel LGA3647 (Rectangular ILM)
Dimensions: 108mm (L) × 78mm (W) × 19.1mm (H)
Thermal Design:
- Fin Thickness: 0.15mm (Laser-Cut Precision)
- Fin Spacing: 0.15mm (High-Density Array)
- Material: Full Copper Base + Copper Fins
Power Dissipation: 350W @ 55°C Ambient
Mounting: Reinforced Backplate for Rectangular Motherboards

Application Scenario

Liquid-cooled hybrid cluster: As an air-cooled front module, it reduces the pump power consumption of the liquid cooling system;
AI inference server: ensures continuous full-frequency operation of the CPU in multi-GPU nodes (such as ResNet-50 batch inference);
Gene sequencing workstation: MTBF >150,000 hours, meeting 7×24 hours of continuous operation;
Hyper-converged infrastructure: compatible with Nutanix/Cisco UCS integrated architecture, reducing PUE to below 1.2.

Technical highlights
Why 0.15mm Fin Technology?

Using laser micro-cutting technology, the tolerance is controlled at ±0.01mm to avoid airflow “dead zone”;
Combined with 0.15mm spacing, the turbulence effect enhances the heat exchange rate, and the measured CFD wind pressure is increased by 27%.

Full Copper vs. Hybrid Designs

The full copper solution has a 40% increase in thermal conductivity compared to the copper-aluminum hybrid design, which is suitable for transient load fluctuation scenarios;
Surface nano-coating reduces the dust accumulation rate by 65% (compared with untreated copper).