LGA3647 4B04 1U server CPU air cooler view 2

LGA3647 4B04 1U server CPU air cooler view 3

LGA3647-4B04 1U Server CPU Heatsink | Intel LGA3647, 75 W

LGA3647-4B04 is a 1U passive CPU heatsink for Intel LGA3647 processors, rated for a 75 W thermal load. Solid-metal construction — aluminium — 108 × 78 × 25.5 mm overall.

75 W rated — 1st–2nd Gen Intel Xeon Scalable (Skylake / Cascade Lake-SP)
108 × 78 × 25.5 mm — 25.5 mm profile for 1U chassis
Aluminium
Passive heatsink — for chassis-ducted airflow; no fan power required

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Engineering overview

Thermal: rated 75 W in a 1U chassis with front-to-back airflow. Fin thickness 0.8 mm, fin spacing 3.3 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Aluminium.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 108 × 78 × 25.5 mm; retention hardware for Intel LGA3647 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA3647-4B04 Specifications

Parameter	Value
Model	LGA3647-4B04
Product type	1U server passive CPU heatsink
Socket / platform	LGA3647 (narrow ILM) — 1st–2nd Gen Intel Xeon Scalable (Skylake / Cascade Lake-SP)
Rated thermal load (TDP)	75 W
Overall size (L × W × H)	108 × 78 × 25.5 mm
Base / fin material	Aluminium
Fin thickness	0.8 mm
Fin spacing	3.3 mm
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA3647-4B04 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.