ToneCooling T-HS202318 copper liquid cold plate for AMD EPYC SP3 (LGA4094) CPUs, 118 × 92 × 16 mm, top view

AMD EPYC SP3 CPU Liquid Cold Plate | T-HS202318

Low-profile copper liquid cold plate for AMD EPYC 7002 / 7003 (SP3, LGA4094) server processors. Rated for 260 W: with 25% EGW at 40 °C inlet the contact surface stays below 55 °C — a 15 K rise, ≈ 0.058 °C/W case-to-inlet — at just 1 LPM and 3 kPa pressure drop. TLP-bonded copper body, 1 MPa working pressure, 118 × 92 × 16 mm. Same 16 mm height class as our SP6 plate (T-HS202319) for mixed-socket fleets.

260 W at < 55 °C surface with 40 °C inlet — covers the full SP3 platform TDP limit
3 kPa at 1 LPM — runs on existing pumps and manifolds, ideal for retrofit loops
16 mm height — clears DIMM latches and 1U lids; SP3 (LGA4094) hole pattern
TLP-bonded copper, 1 MPa rated — diffusion-bonded core, no braze filler; every unit leak-tested before shipment

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Download Datasheet (PDF)T-HS202318 · Rev. A · Sept 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 15 K case-to-inlet rise at rated load, measured at the IHS contact area with 25% EG/water. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 3 kPa at 1 LPM is among the lowest pressure drops in our CPU range, so dual-socket nodes can be fed in series from one manifold branch without a pump upgrade.
Mechanical: 118 × 92 mm copper base sized to the SP3 IHS; 16 mm overall height with in-plane ports for 1U trays; mounts to the standard LGA4094 retention frame. Custom port orientation on request.
Construction: transient liquid-phase (TLP) diffusion-bonded copper — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202318 Specifications (as tested)

Parameter	Value
Model	T-HS202318
Target device	AMD EPYC 7002 / 7003 series, socket SP3 (LGA4094)
Rated heat load	260 W
Coolant (as tested)	25% EG / water (EGW)
Inlet coolant temperature	40 °C
Max. plate surface temperature	< 55 °C
Case-to-inlet thermal resistance	≈ 0.058 °C/W (calculated from rated point)
Flow rate / pressure drop	1 LPM / 3 kPa
Working pressure rating	1 MPa
Dimensions (L × W × H)	118 × 92 × 16 mm
Base material	Copper
Bonding process	TLP – Transient Liquid-Phase Diffusion Bonding
Leak test	100% pressure-tested before shipment

Typical applications

AMD EPYC Rome / Milan servers — 1U and 2U dual-socket nodes with CPU SKUs up to 260 W
High-density multi-node chassis — 2U4N and blade systems where 16 mm height and 3 kPa per socket keep the loop simple
Retrofit of air-cooled SP3 fleets — replaces the stock heatsink on the existing LGA4094 retention frame
Edge and telecom compute — sealed enclosures where fan-less CPU cooling is required

Ordering & RFQ

How to order: quote model T-HS202318 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: CPU SKU and TDP, quantity, coolant type, inlet temperature, target flow rate per socket and chassis height limit. Send a STEP/PDF of your tray if port position matters.

FAQ

Does it fit both EPYC 7002 and 7003? Yes — both generations use socket SP3 (LGA4094) with the same IHS footprint and retention frame; the plate is validated against the 260 W platform limit.

Can it run on warm water? The rated point is 40 °C inlet with 25% EGW. Higher inlet temperatures are possible at reduced load; pure water or PGW loops are supported — performance is validated per coolant on request.

What is included? Cold plate, mounting hardware for the SP3 retention frame, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

AMD and EPYC are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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AMD EPYC SP6 CPU Liquid Cold Plate | T-HS202319

Intel Eagle Stream CPU Liquid Cold Plate – 700 W | T-HS202309

Intel Eagle Stream CPU Liquid Cold Plate – 350 W | T-HS202310

Intel Xeon X3 CPU Liquid Cold Plate | T-HS202302

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