ToneCooling T-HS202309 Intel eagle stream cpu liquid cold plate 700 w, product view

Intel Eagle Stream CPU Liquid Cold Plate – 700 W | T-HS202309

High-power version of the Eagle Stream kit for 700 W per-socket TDPs in the same 118 × 78 × 25 mm envelope. Denser micro-channel core holds 700 W below 64 °C at 40 °C inlet (24 K rise, ≈ 0.034 °C/W) at 1.1 LPM / 16 kPa — the same flow and pressure budget as the 350 W plate, so a loop designed for one accepts the other.

700 W × 2 at < 64 °C surface with 40 °C inlet — 24 K case-to-inlet rise on 25% EG / water (EGW)
16 kPa at 1.1 LPM — moderate pressure drop, sized for standard CDU branches
118 × 78 × 25 mm — 25 mm profile; port position to your chassis layout
TLP-bonded copper, 1 MPa rated — every unit leak-tested before shipment

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Download Datasheet (PDF)T-HS202309 · Rev. A · Sept 2026

Products Categories

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TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 24 K case-to-inlet rise at rated load, measured at the contact area with 25% EG / water (EGW). Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 16 kPa at 1.1 LPM — moderate pressure drop, sized for standard CDU branches; validated on our flow bench at the rated inlet temperature of 40 °C.
Mechanical: 118 × 78 × 25 mm copper plate, 25 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202309 Specifications (as tested)

Parameter	Value
Model	T-HS202309
Target device	Intel Eagle Stream CPU — 700 W
Rated heat load	700 W × 2
Coolant (as tested)	25% EG / water (EGW)
Inlet coolant temperature	40 °C
Max. plate surface temperature	< 64 °C
Case-to-inlet thermal resistance	≈ 0.034 °C/W per device (from rated point)
Flow rate / pressure drop	1.1 LPM / 16 kPa
Working pressure rating	1 MPa
Dimensions (L × W × H)	118 × 78 × 25 mm
Base material	Copper
Bonding process	TLP – Transient Liquid-Phase Diffusion Bonding
Leak test	100% pressure-tested before shipment

Typical applications

High-TDP HPC and AI training nodes
Dual-socket servers with 700 W-class CPUs
Drop-in upgrade for 350 W Eagle Stream loops

Ordering & RFQ

How to order: quote model T-HS202309 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 40 °C inlet with 25% EG / water (EGW). Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

Intel and Xeon are trademarks of Intel Corporation. Referenced for compatibility only; ToneCooling is an independent manufacturer.