Guangdong, China
Global Engineering RFQ Review
ToneCooling T-HS202304 asic switch chip liquid cold plate 1000 1500 w, product view
ToneCooling T-HS202304 asic switch chip liquid cold plate 1000 1500 w, product view

ASIC / Switch Chip Liquid Cold Plate 1000–1500 W | T-HS202304/15/16

Compact 83 × 70 × 16.3 mm copper cold plate for high-power switch ASICs and bare GPU dies at 1000 W. Pure water at 2 LPM / 8 kPa and 30 °C inlet keeps the surface below 45 °C — a 15 K rise, ≈ 0.015 °C/W. Same envelope and fittings across the 1000 / 1200 / 1500 W family, so a board layout can be upgraded without redesign.

  • 1000 W / 1200 W / 1500 W at < 45 °C surface with 30 °C inlet — three ratings in one 83 × 70 × 16.3 mm envelope
  • 8 kPa at 2 LPM — moderate pressure drop, sized for standard CDU branches
  • 83 × 70 × 16.3 mm — 16.3 mm profile; port position to your chassis layout
  • TLP-bonded copper, 1 MPa rated — every unit leak-tested before shipment
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Engineering overview

  • Thermal: 15 K case-to-inlet rise at rated load, measured at the contact area with pure water. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
  • Hydraulic: 8 kPa at 2 LPM — moderate pressure drop, sized for standard CDU branches; validated on our flow bench at the rated inlet temperature of 30 °C.
  • Mechanical: 83 × 70 × 16.3 mm copper plate, 16.3 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
  • Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
  • Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202304 / T-HS202315 / T-HS202316 Specifications (as tested)

ParameterT-HS202304T-HS202315T-HS202316
Target deviceGPU / Switch ASIC — 1000 WGPU / Switch ASIC — 1200 WGPU / Switch ASIC — 1500 W
Rated heat load1000 W1200 W1500 W
Coolant (as tested)Pure waterPure waterPure water
Inlet coolant temperature30 °C30 °C30 °C
Max. plate surface temperature< 45 °C< 45 °C< 45 °C
Case-to-inlet thermal resistance≈ 0.015 °C/W (calculated from rated point)≈ 0.013 °C/W (calculated from rated point)≈ 0.010 °C/W (calculated from rated point)
Flow rate / pressure drop2 LPM / 8 kPa2 LPM / 8 kPa2 LPM / 8 kPa
Working pressure rating1 MPa1 MPa1 MPa
Dimensions (L × W × H)83 × 70 × 16.3 mm83 × 70 × 16.3 mm83 × 70 × 16.3 mm
Base materialCopperCopperCopper
Bonding processTLP – Transient Liquid-Phase Diffusion BondingTLP – Transient Liquid-Phase Diffusion BondingTLP – Transient Liquid-Phase Diffusion Bonding
Leak test100% pressure-tested before shipment100% pressure-tested before shipment100% pressure-tested before shipment

Typical applications

  • High-radix data center switch ASICs
  • Custom AI accelerator packages
  • Test and burn-in fixtures

Ordering & RFQ

How to order: quote model T-HS202304 / T-HS202315 / T-HS202316 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 30 °C inlet with pure water. Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

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