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Global Engineering RFQ Review
ToneCooling T-HS202323 NVIDIA h100 8 gpu nvswitch liquid cooling assembly, product view
ToneCooling T-HS202323 NVIDIA h100 8 gpu nvswitch liquid cooling assembly, product view

NVIDIA H100 8-GPU + NVSwitch Liquid Cooling Assembly | T-HS202323

Complete direct-to-chip module for the NVIDIA HGX H100 8-GPU baseboard: eight SXM5 GPU cold plates and four NVSwitch plates on integrated manifolds with quick-disconnects, delivered leak-tested as one unit. Removes ≈ 6.3 kW with pure water at 9 LPM / 40 kPa and 45 °C inlet, keeping every die contact surface below 80 °C for full-boost operation.

  • 700 W × 8 + 186 W × 4 at < 80 °C surface with 45 °C inlet — 35 K case-to-inlet rise on pure water
  • 40 kPa at 9 LPM — sized for a dedicated CDU branch at the rated flow
  • 472.7 × 331 × 130.6 mm — 130.6 mm profile; port position to your chassis layout
  • TLP-bonded copper, 1 MPa rated — every unit leak-tested before shipment
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Engineering overview

  • Thermal: 35 K case-to-inlet rise at rated load, measured at the contact area with pure water. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
  • Hydraulic: 40 kPa at 9 LPM — sized for a dedicated CDU branch at the rated flow; validated on our flow bench at the rated inlet temperature of 45 °C.
  • Mechanical: 472.7 × 331 × 130.6 mm copper plate, 130.6 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
  • Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
  • Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202323 Specifications (as tested)

ParameterValue
ModelT-HS202323
Target deviceNVIDIA H100 8-GPU + NVSwitch Liquid Cooling Assembly
Rated heat load700 W × 8 + 186 W × 4
Coolant (as tested)Pure water
Inlet coolant temperature45 °C
Max. plate surface temperature< 80 °C
Case-to-inlet thermal resistance≈ 0.0055 °C/W (assembly, from rated point)
Flow rate / pressure drop9 LPM / 40 kPa
Working pressure rating1 MPa
Dimensions (L × W × H)472.7 × 331 × 130.6 mm
Base materialCopper
Bonding processTLP – Transient Liquid-Phase Diffusion Bonding
Leak test100% pressure-tested before shipment

Typical applications

  • HGX H100 AI training clusters
  • Liquid-cooled AI racks with CDU
  • OEM / ODM server integration

Ordering & RFQ

How to order: quote model T-HS202323 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 45 °C inlet with pure water. Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

NVIDIA and the GPU model names are trademarks of NVIDIA Corporation. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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