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ToneCooling 1U CPU Liquid Cooler thermal management
ToneCooling 1U CPU Liquid Cooler thermal management

1U LGA4189 CPU Liquid Cooler, Copper Block, 500 W

1U closed-loop liquid cooler for 3rd Gen Intel Xeon Scalable (LGA4189). 1 model rated 500 W, covering Intel LGA4189. Each module ships as a sealed, factory-filled loop: full-copper skived micro-channel cold plate, integrated pump, brazed aluminium radiator and platform-specific mounting kit — no external CDU or facility water required.

  • 500 W rated — 1 model across Intel LGA4189
  • 1U rack server — radiator 395.1 × 60 × 40 mm
  • Thermal resistance 0.036–0.055 °C/W @ 25 °C — pump 4.5 L/min max / 1.5 m max head
  • Sealed loop, leak-tested — full-copper skived cold plate, brazed aluminium radiator
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Engineering overview

  • Thermal: typical cold-plate thermal resistance 0.036–0.055 °C/W @ 25 °C (case-to-coolant, 25 °C ambient). Rated TDP per model is listed in the table; final CPU temperature depends on chassis airflow and inlet air temperature.
  • Hydraulic: integrated 40 × 40 mm, PWM 3200 rpm pump, 4.5 L/min max flow and 1.5 m max head; sealed loop, no user fill or maintenance.
  • Mechanical: 1U rack server radiator with 8 × 40 mm fans; hose custom length; platform-specific retention kit for each socket.
  • Construction: full-copper skived micro-channel cold plate, brazed; high-density brazed aluminium radiator with black powder coat; every unit pressure- and leak-tested before shipment.
  • Control: 4-pin PWM fans and PWM pump — speed follows the board’s CPU-temperature fan curve.

Model range and specifications

ModelPlatformRated TDPRadiator (L × W × H)Fans
DWA36040CUI1002RIntel LGA4189
3rd Gen Intel Xeon Scalable		500 W395.1 × 60 × 40 mm8 × 40 mm

Common specifications

ParameterValue
Form factor1U rack server
Radiator fans8 × 40 mm
Pump40 × 40 mm, PWM 3200 rpm
Pump flow rate4.5 L/min max
Pump head1.5 m max
Hose lengthcustom length
Thermal resistance (typ.)0.036–0.055 °C/W @ 25 °C
Cold plateFull-copper skived micro-channel, brazed
RadiatorHigh-density brazed aluminium, black powder coat
LoopSealed, factory-filled; every unit leak-tested before shipment
MountingPlatform-specific screw kit included

Typical applications

  • 1U LGA4189 servers
  • Dense compute nodes
  • Edge servers

Ordering & RFQ

How to order: quote the model number from the table with quantity and target chassis. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: CPU/GPU model and TDP, chassis height and available radiator bay, fan-header power budget, hose routing and expected quantity. Send a STEP/PDF of your chassis if radiator position matters.

FAQ

Does it need a CDU or facility water? No — the loop is sealed and factory-filled; the radiator rejects heat to chassis airflow like an air cooler.

Can the hose length or radiator position be changed? Yes — hose length and radiator orientation are set per chassis drawing; the qualified pump-block stays unchanged.

What is included? Cold-plate/pump block, radiator with fans, hose set, mounting kit and thermal paste; leak-test report on request.

Intel, Xeon, AMD, EPYC and Ryzen are trademarks of their respective owners. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related products

2U TC-LGA4189 Vapor Chamber Cooler | 300W TDP2U TC-LGA4189 Vapor Chamber Cooler | 300W TDP2U TC-LGA4189 Heat Pipe Cooler | 300W TDP Copper Base2U TC-LGA4189 Heat Pipe Cooler | 300W TDP Copper BaseTC-LGA4189 1U Server Cooler | 205W TDPTC-LGA4189 1U Server Cooler | 205W TDPLGA4189-2B07 1U Server CPU Heatsink | Intel LGA4189, 230 WLGA4189-2B07 1U Server CPU Heatsink | Intel LGA4189, 230 W

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By ToneCooling Engineering Team · Last updated:
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