1U TC-LGA4189 CPU Liquid Cooler | Cu Block/Fin Server

This compact TC-LGA4189 CPU water cooler is designed for Intel Xeon processors in 1U server environments. Its full-copper construction ensures efficient heat dissipation in space-constrained applications.

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Hybrid Cooling Innovation

Copper Microchannel Cold Plate: Direct-contact design with 0.1mm micro-fins for 20% higher thermal transfer vs. traditional cold plates.
Dual-Mode Operation: Switch passively between liquid cooling and auxiliary air cooling during pump maintenance.
1U-Optimized Radiator: Stackable aluminum fins with anti-corrosion coating, compatible with rear-mount or side-mount server configurations.
Smart Leak Detection: IoT-enabled sensors with SNMP alerts for proactive maintenance in mission-critical racks.
Pre-Filled, Maintenance-Free: Factory-sealed loop with low-evaporation coolant, rated for 10+ years of 24/7 operation.

Key Features and Specifications:

CPU Socket Type: TC-LGA4189, designed for Intel Xeon processors.
Product Dimensions: 113mm * 78mm * 19.1mm, ideal for 1U server form factors.
Power Consumption: Supports CPUs with a TDP up to 400W.
Fin Thickness: 0.15mm, maximizing surface area for effective heat transfer.
Fin Spacing: 0.15mm, optimizing coolant flow and heat exchange.
Material Composition: Copper block and copper fins for superior thermal conductivity.
Cooling Type: Water cooling.
Voltage Rating: 12V DC.

Designed for ultra-dense, high-power server architectures, the 1U LGA4189 CPU Liquid Cooler combines liquid cooling efficiency with copper-block thermal precision to address the most demanding compute scenarios. Its hybrid cooling solution is ideal for

Hyperscale Data Centers
Optimizes thermal management for Intel Xeon Scalable CPUs (up to 400W TDP) in 1U racks, reducing energy costs by 30% compared to air cooling. Ideal for cloud-native workloads like AWS EC2 instances or Azure Kubernetes nodes.
AI/GPU-Accelerated Compute
Sustains peak performance in NVIDIA HGX GPU-adjacent CPU nodes, preventing thermal interference during large-language model (LLM) training or real-time inference tasks.
Exascale HPC Clusters
Cools CPUs in supercomputers handling quantum simulations, nuclear research, or weather forecasting, leveraging liquid’s superior heat capacity for sustained 100% core utilization.
Low-Latency Financial Trading
Enables sub-microsecond response times in HFT servers by eliminating CPU thermal spikes, with copper cold plates ensuring rapid heat transfer from high-frequency trading processors.
5G Core Network Virtualization
Deploys in 1U NFVI (Network Functions Virtualization Infrastructure) servers for 5G SA cores, maintaining stability in high-throughput UPF (User Plane Function) workloads.

Cooling Performance and Design:

This water cooler features a copper block and copper fin construction. The 0.15mm fin pitch maximizes heat dissipation5. It is designed to support CPUs up to 400W TDP.

Important Considerations:

Server Form Factor: Specifically designed for 1U servers, ensuring compatibility with space constraints.
Liquid Cooling System: Requires integration with a liquid cooling system for operation.
Alternative Solutions: Active air coolers and passive heat sinks are also available for the LGA4189 socket.

The optimal TC-LGA4189 CPU cooler depends on the server’s specific cooling requirements and operating environment.

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