AMD EPYC SP5 CPU Liquid Cold Plate | T-HS202301

Cold plate for AMD EPYC 9004/9005 (SP5, LGA6096) at up to 550 W. Copper TLP-bonded micro-channel core keeps the 118 × 92 mm contact surface below 52 °C at 42 °C inlet — a 10 K rise, ≈ 0.018 °C/W case-to-inlet, the lowest resistance in the CPU range. 10 kPa at 1 LPM; supports warm-water (≥ 40 °C) facility loops.

550 W at < 52 °C surface with 42 °C inlet — 10 K case-to-inlet rise on 25% EG / water (EGW)
10 kPa at 1 LPM — moderate pressure drop, sized for standard CDU branches
118 × 92.4 × 25 mm — 25 mm profile; port position to your chassis layout
TLP-bonded copper, 1 MPa rated — every unit leak-tested before shipment

Get A Free Quote

Download Datasheet (PDF)T-HS202301 · Rev. A · Sept 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 10 K case-to-inlet rise at rated load, measured at the contact area with 25% EG / water (EGW). Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 10 kPa at 1 LPM — moderate pressure drop, sized for standard CDU branches; validated on our flow bench at the rated inlet temperature of 42 °C.
Mechanical: 118 × 92.4 × 25 mm copper plate, 25 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202301 Specifications (as tested)

Parameter	Value
Model	T-HS202301
Target device	AMD EPYC SP5 CPU
Rated heat load	550 W
Coolant (as tested)	25% EG / water (EGW)
Inlet coolant temperature	42 °C
Max. plate surface temperature	< 52 °C
Case-to-inlet thermal resistance	≈ 0.018 °C/W (calculated from rated point)
Flow rate / pressure drop	1 LPM / 10 kPa
Working pressure rating	1 MPa
Dimensions (L × W × H)	118 × 92.4 × 25 mm
Base material	Copper
Bonding process	TLP – Transient Liquid-Phase Diffusion Bonding
Leak test	100% pressure-tested before shipment

Typical applications

AMD EPYC Genoa / Turin AI and HPC servers
Cloud and hyperscale compute nodes
Warm-water (W40) facility loops

Ordering & RFQ

How to order: quote model T-HS202301 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 42 °C inlet with 25% EG / water (EGW). Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

AMD and EPYC are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.

Related products

2U Dual-Channel CPU Liquid Cooling Modules for Servers

Server Liquid Cooling System with 120 mm Radiator, 4U

Closed-Loop Liquid Cooling Modules for 4U Servers, Intel & AMD

2U Server Closed-Loop Liquid Cooling Modules, Intel & AMD

Get A Free Quote Now

How to Maintain Liquid-Cooled Systems for Peak Performance

Liquid-cooled systems stay at peak performance with the right coolant chemistry, filtration, regular inspection for leaks and corrosion, and monitoring […]

Learn More >>

How to Maximize Processor Performance with Water Cooling

Water cooling improves processor performance by carrying heat away from the CPU faster than air, so the chip stays below […]

Learn More >>

Critical Challenges of Data Center Thermal Management

Data centers today face growing challenges in thermal management as high-performance servers, AI workloads, and dense storage systems generate unprecedented […]

Learn More >>

Explore the Best GPU Cooling Solution For High-Performance Gaming

The best GPU cooling depends on heat load and space: air coolers with vapor chambers suit most cards, while liquid […]

Learn More >>

Best Coolant Options for Mixed-Metal AIO Cooling Systems

Choosing the best coolant for copper cold plate and aluminum radiator in AIO cooling systems ensures optimal performance and long-term […]

Learn More >>

Cold Plate Bending Issues on AMD CPU IHS

Learn More >>

Liquid Cooled GPUs: Are They Worth Considering

Liquid-cooled GPUs are worth it when you need sustained high performance, high density or low noise, because coolant removes heat […]

Learn More >>