LGA1700 1B02 1U server CPU air cooler view 2

LGA1700 1B02 1U server CPU air cooler view 3

LGA1700-1B02 1U Server CPU Heatsink | Intel LGA1700, 125 W

LGA1700-1B02 is a 1U passive CPU heatsink for Intel LGA1700 processors, rated for a 125 W thermal load. Solid-metal construction — copper — 88 × 88 × 25 mm overall. Mounting hole pitch 78 x 78 mm.

125 W rated — Intel Core 12th–14th Gen (LGA1700)
88 × 88 × 25 mm — 25 mm profile for 1U chassis
Copper
Passive heatsink — for chassis-ducted airflow; no fan power required

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Engineering overview

Thermal: rated 125 W in a 1U chassis with front-to-back airflow. Fin thickness 0.3 mm, fin spacing 2.1 mm; the fin stack is sized for the static pressure of standard server fan walls.
Heat path: Copper.
Airflow: passive design — relies on chassis fans; keep the fin direction aligned with the chassis airflow.
Mechanical: 88 × 88 × 25 mm; mounting hole pitch 78 x 78 mm; retention hardware for Intel LGA1700 included.
Customisation: fin height, fan selection, surface finish and pre-applied TIM per project; drawings and 3D models on request.

LGA1700-1B02 Specifications

Parameter	Value
Model	LGA1700-1B02
Product type	1U server passive CPU heatsink
Socket / platform	LGA1700 (square ILM) — Intel Core 12th–14th Gen (LGA1700)
Rated thermal load (TDP)	125 W
Overall size (L × W × H)	88 × 88 × 25 mm
Mounting hole pitch	78 x 78 mm
Base / fin material	Copper
Fin thickness	0.3 mm
Fin spacing	2.1 mm
Rated voltage	12 V
Compliance	RoHS
Note	Final performance depends on chassis airflow, inlet air temperature, fan curve, TIM and mounting pressure; validate against the CPU thermal limit.

Typical applications

1U rack servers
Edge and telecom compute nodes
Dense storage and network appliances

Ordering & RFQ

How to order: quote model LGA1700-1B02 with quantity and target chassis. Samples 1–5 pcs; production quantities after drawing approval.

RFQ checklist: CPU model and TDP, chassis height and airflow direction, available fan headers and power budget, inlet air temperature, expected quantity. Send a STEP/PDF of your chassis if fin orientation or height matters.

FAQ

Does the TDP rating guarantee CPU temperature? No — the rating is the reference load; final CPU temperature depends on chassis airflow, inlet temperature and fan curve. We validate against your system data on request.

Can the mounting be adapted? Yes — retention hardware is platform-specific; alternative brackets and custom pitches are handled per drawing.

What is included? Heatsink/cooler, mounting hardware and thermal paste (or pre-applied TIM on request).

Intel and Xeon are trademarks of Intel Corporation; AMD, EPYC and Ryzen are trademarks of Advanced Micro Devices, Inc. Referenced for compatibility only; ToneCooling is an independent manufacturer.