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ToneCooling LGA1700-1U3C Compact 1U CPU Cooler thermal management
ToneCooling Compact 1U CPU Cooler for Intel 12th13th Gen thermal management
ToneCooling LGA1700-1U3C Compact 1U CPU Cooler thermal management
ToneCooling Compact 1U CPU Cooler for Intel 12th13th Gen thermal management

LGA1700-1U3C: Compact 1U CPU Cooler for Intel 12th/13th Gen

The LGA1700-1U3C is an ultra-compact 1U server-grade CPU cooler engineered for Intel® 12th/13th Gen Core™ processors (LGA1700). Featuring an all-copper thermal stack and a high-RPM dual-ball bearing fan, it delivers 115W TDP cooling in space-constrained environments while maintaining industrial-grade durability.

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Core Advantages

1. Full-Copper Thermal Excellence

  • Integrated Copper Base & Fins: 32% higher thermal conductivity vs. aluminum solutions, with ΔT ≤12°C (@115W load);
  • Optimized Airflow: 27mm slim profile reduces turbulence in 1U chassis, boosting cooling efficiency by 18%.

2. Intelligent Noise Control

  • PWM Stepless Speed Adjustment (1000-6000 RPM): Auto-drops to ≤28 dBA under <30% load;
  • Double Ball Bearing: MTTF 60,000h certification, operable from -20°C to 70°C.

3. Precision Compatibility

  • LGA1700 Square Bracket: Reinforced backplate prevents motherboard warping (ASUS WS W680 tested);
  • Tool-Free Installation: Pre-mounted Intel LGA1700 brackets deploy in <90 seconds.

Technical Specifications

  • Model: LGA1700-1U3C
  • Socket: LGA1700 (Square ILM Motherboard)
  • Dimensions: 90mm × 89mm × 27mm (1U Height)
  • Thermal Design: Copper Base + Copper Fins
  • Fan Specs:
    • Speed: 1000-6000 RPM (4-Pin PWM)
    • Airflow: 18 CFM (Max)
    • Noise: ≤56 dBA @ Full Load
    • Bearing: Double Ball Bearing (60,000h Lifespan)
  • Power: 12V, 115W TDP Support
  • Mounting: 78×78mm Hole Spacing

Key Applications

  • Edge Servers/Micro Data Centers: 1U rack compatibility for compact deployments;
  • Digital Signage & Industrial PCs: Dust-resistant design, MIL-STD-202G vibration certified;
  • High-Performance Workstations: Supports Intel Core™ i9-13900K overclocking (5.8GHz all-core);
  • Silent NAS Systems: Noise <30 dBA at low RPM for office environments.

Technical Highlights

Why Full Copper?

  • Laser-welded copper fins reduce contact thermal resistance by 25%;
  • Anti-oxidation coating triples lifespan vs. nickel-plated solutions.

Smart PWM Algorithm

  • Dynamically adjusts fan curves based on core temperature to minimize noise spikes;
  • Compatible with BIOS/SpeedFan for granular control.

Why Choose LGA1700-1U3C?

  • ✅ Military-Grade Reliability: Passes 48h salt spray (5% NaCl) & 80G shock tests;
  • ✅ Maintenance-Free: Sealed bearing design eliminates lubricant leakage;
  • ✅ Cost-Effective: 15% cheaper than competing full-copper coolers (bulk OEM supported).
If you are interested, please contact us!!!
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