ToneCooling T-HS202320 NVIDIA l20 gpu liquid cold plate, product view

NVIDIA L20 GPU Liquid Cold Plate | T-HS202320

Full-length single-slot copper cold plate that converts the passive dual-slot NVIDIA L20 into a 19 mm liquid-cooled module, doubling GPU density per chassis. 350 W held below 59 °C at 50 °C inlet (9 K rise, ≈ 0.026 °C/W) with only 3 kPa at 0.8 LPM — suitable for eight cards in series-parallel on one manifold.

350 W at < 59 °C surface with 50 °C inlet — 9 K case-to-inlet rise on 40% EG / water (EGW)
3 kPa at 0.8 LPM — low pressure drop for series and manifold loops
265 × 97 × 19 mm — 19 mm profile; port position to your chassis layout
TLP-bonded copper, 1 MPa rated — every unit leak-tested before shipment

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Download Datasheet (PDF)T-HS202320 · Rev. A · Sept 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 9 K case-to-inlet rise at rated load, measured at the contact area with 40% EG / water (EGW). Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 3 kPa at 0.8 LPM — low pressure drop for series and manifold loops; validated on our flow bench at the rated inlet temperature of 50 °C.
Mechanical: 265 × 97 × 19 mm copper plate, 19 mm overall height. Mounting pattern matches the target device; custom port orientation and fittings on request.
Construction: TLP – Transient Liquid-Phase Diffusion Bonding — a homogeneous metallurgical joint with no braze filler or flux residue in the coolant path; 1 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202320 Specifications (as tested)

Parameter	Value
Model	T-HS202320
Target device	NVIDIA L20 GPU
Rated heat load	350 W
Coolant (as tested)	40% EG / water (EGW)
Inlet coolant temperature	50 °C
Max. plate surface temperature	< 59 °C
Case-to-inlet thermal resistance	≈ 0.026 °C/W (calculated from rated point)
Flow rate / pressure drop	0.8 LPM / 3 kPa
Working pressure rating	1 MPa
Dimensions (L × W × H)	265 × 97 × 19 mm
Base material	Copper
Bonding process	TLP – Transient Liquid-Phase Diffusion Bonding
Leak test	100% pressure-tested before shipment

Typical applications

AI inference and video analytics servers
High-density 8-GPU 4U chassis
Warm-water data center loops

Ordering & RFQ

How to order: quote model T-HS202320 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: target device and heat load, quantity, coolant type, inlet temperature, target flow rate and available envelope. Send a STEP/PDF of your tray or assembly if port position matters.

FAQ

Can it run on warm water? The rated point is 50 °C inlet with 40% EG / water (EGW). Other inlet temperatures and coolants (pure water, EGW, PGW) are supported — performance is validated per coolant on request.

Can the ports or fittings be customised? Yes — fitting type, thread and inlet/outlet position are set per drawing without changing the qualified core.

What is included? Cold plate, mounting hardware, recommended TIM and torque spec, leak-test report. Datasheet PDF available above; STEP file on request.

NVIDIA and the GPU model names are trademarks of NVIDIA Corporation. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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