ToneCooling T-HS202321 NVIDIA L40 GPU liquid cold plate, single-slot copper

NVIDIA L40 GPU Liquid Cold Plate | T-HS202321

Single-slot copper liquid cold plate for the NVIDIA L40 data-center GPU. Rated for 270 W: with 40% EGW at 50 °C inlet the contact surface stays below 56 °C — a 6 K rise, ≈ 0.022 °C/W case-to-inlet — at only 0.8 LPM and 3 kPa pressure drop. Friction-stir-welded copper body, 1 MPa working pressure, 265 × 97 × 19 mm. Same envelope as our L20 plate (T-HS202320) for mixed-GPU racks.

270 W at < 56 °C surface with 50 °C warm-water inlet — no chiller required
3 kPa at 0.8 LPM — eight cards in series-parallel on one manifold pair without starving the last card
True single-slot, 19 mm — converts the passive 2-slot L40 into a 1-slot liquid-cooled module
FSW copper, 1 MPa rated — no brazing filler, no flux residue; every unit leak-tested before shipment

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Download Datasheet (PDF)T-HS202321 · Rev. A · Sept 2026

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: 6 K case-to-inlet rise at rated load; measured at the die contact area with 40% EG/water. Thermal interface material and mounting pressure set the final junction temperature — we supply the recommended TIM and torque spec with each order.
Hydraulic: 3 kPa at 0.8 LPM is among the lowest pressure drops in our GPU range, so an 8-GPU chassis can run on a single CDU branch at moderate flow.
Mechanical: full-length single-slot plate, 265 × 97 × 19 mm, mounts on the reference PCB hole pattern; AIB card variants are reviewed on request.
Construction: friction-stir-welded copper — one homogeneous joint, no internal seam exposed to coolant, 1 MPa working pressure, 100% pressure-tested.
Fittings: G1/4 quick-disconnect, barb or custom per drawing; inlet/outlet position to your chassis layout.

T-HS202321 Specifications (as tested)

Parameter	Value
Model	T-HS202321
Target device	NVIDIA L40 GPU (single-slot)
Rated heat load	270 W
Coolant (as tested)	40% EG / water (EGW)
Inlet coolant temperature	50 °C
Max. plate surface temperature	< 56 °C
Case-to-inlet thermal resistance	≈ 0.022 °C/W (calculated from rated point)
Flow rate / pressure drop	0.8 LPM / 3 kPa
Working pressure rating	1 MPa
Dimensions (L × W × H)	265 × 97 × 19 mm
Base material	Copper
Bonding process	FSW – Friction Stir Welding
Leak test	100% pressure-tested before shipment

Typical applications

Generative-AI inference and rendering servers — 8 × L40 in a 4U chassis at single-slot pitch
Virtual workstation (vGPU) hosts — quiet, fan-less GPU trays for VDI and cloud graphics
Warm-water data centers — validated at 50 °C inlet for W40/W45 facility loops and heat reuse
GPU retrofit programmes — drop-in replacement of the passive heatsink on existing L40 fleets

Ordering & RFQ

How to order: quote model T-HS202321 with quantity and required fitting type. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: L40 PCB vendor (reference or AIB), quantity, coolant type, inlet temperature, target flow rate and chassis slot pitch. Send a STEP/PDF of your tray if port position matters.

FAQ

Does it fit AIB versions of the L40? The plate is built for the reference PCB. Send your card model and we confirm fit or adapt the mounting pattern.

Can it run on warm water? Yes — the rated point is 50 °C inlet with 40% EGW. Pure water or PGW loops are supported; performance is validated per coolant on request.

What is included? Cold plate, mounting hardware, thermal pads for memory/VRM, recommended TIM and torque spec, leak-test report. Datasheet PDF and STEP file available above.

Related products

NVIDIA GB200 Liquid Cold Plate Kit | TC-BZP-GB200-01A

NVIDIA H200 Liquid Cooling Plate: HGX H200 Direct-to-Chip Kit

ASIC / Switch Chip Liquid Cold Plate 1000–1500 W | T-HS202304/15/16

NVIDIA H100 8-GPU + NVSwitch Liquid Cooling Assembly | T-HS202323

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