ToneCooling Server liquid cooling system cold end pump thermal management

ToneCooling liquid cooling system thermal management

ToneCooling Server liquid cooling system cold end pump design and silent and efficient heat dissipation thermal management

4U Server Liquid Cooling Modules for AMD EPYC, 500 W

4U closed-loop modules for AMD SP3 / SP6 and SP5 with quiet 120 mm fans. 2 models rated 500 W, covering AMD SP3 / SP6, AMD SP5. Each module ships as a sealed, factory-filled loop: full-copper skived micro-channel cold plate, integrated pump, brazed aluminium radiator and platform-specific mounting kit — no external CDU or facility water required.

500 W rated — 2 models across AMD SP3 / SP6, AMD SP5
4U rack server — radiator 396 × 27 × 120 mm
Thermal resistance 0.035–0.045 °C/W @ 25 °C — pump 4.5 L/min max / 1.5 m max head
Sealed loop, leak-tested — full-copper skived cold plate, brazed aluminium radiator

Products Categories

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

TC-LGA 2066/2011 Square

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

Engineering overview

Thermal: typical cold-plate thermal resistance 0.035–0.045 °C/W @ 25 °C (case-to-coolant, 25 °C ambient). Rated TDP per model is listed in the table; final CPU temperature depends on chassis airflow and inlet air temperature.
Hydraulic: integrated 40 × 40 mm, PWM 3200 rpm pump, 4.5 L/min max flow and 1.5 m max head; sealed loop, no user fill or maintenance.
Mechanical: 4U rack server radiator with 3 × 120 mm fans; hose 450 mm; platform-specific retention kit for each socket.
Construction: full-copper skived micro-channel cold plate, brazed; high-density brazed aluminium radiator with black powder coat; every unit pressure- and leak-tested before shipment.
Control: 4-pin PWM fans and PWM pump — speed follows the board’s CPU-temperature fan curve.

Model range and specifications

Model	Platform	Rated TDP	Radiator (L × W × H)	Fans
DWA36012CUA1001R	AMD SP3 / SP6 AMD EPYC 7002 / 7003 (SP3), EPYC 8004 (SP6)	500 W	396 × 27 × 120 mm	3 × 120 mm
DWA36012CUA2001R	AMD SP5 AMD EPYC 9004	500 W	396 × 27 × 120 mm	3 × 120 mm

Common specifications

Parameter	Value
Form factor	4U rack server
Radiator fans	3 × 120 mm
Pump	40 × 40 mm, PWM 3200 rpm
Pump flow rate	4.5 L/min max
Pump head	1.5 m max
Hose length	450 mm
Thermal resistance (typ.)	0.035–0.045 °C/W @ 25 °C
Cold plate	Full-copper skived micro-channel, brazed
Radiator	High-density brazed aluminium, black powder coat
Loop	Sealed, factory-filled; every unit leak-tested before shipment
Mounting	Platform-specific screw kit included

Typical applications

4U AMD EPYC servers
Tower servers
Lab and office racks

Ordering & RFQ

How to order: quote the model number from the table with quantity and target chassis. Samples 1–5 pcs with leak-test report; production quantities after drawing approval.

RFQ checklist: CPU/GPU model and TDP, chassis height and available radiator bay, fan-header power budget, hose routing and expected quantity. Send a STEP/PDF of your chassis if radiator position matters.

FAQ

Does it need a CDU or facility water? No — the loop is sealed and factory-filled; the radiator rejects heat to chassis airflow like an air cooler.

Can the hose length or radiator position be changed? Yes — hose length and radiator orientation are set per chassis drawing; the qualified pump-block stays unchanged.

What is included? Cold-plate/pump block, radiator with fans, hose set, mounting kit and thermal paste; leak-test report on request.

Intel, Xeon, AMD, EPYC and Ryzen are trademarks of their respective owners. Referenced for compatibility only; ToneCooling is an independent manufacturer.

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By ToneCooling Engineering Team · Last updated: September 14, 2026