Boost Data Center Reliability with Closed-Loop Series Liquid Cooling Modules
- The pump is integrated with the radiator using the welding technology, which reduces the manual joints and the risk of leakage.
- The size of the radiator can be flexibly adjusted to meet various specifications of the server chassis; For example, 1U, 2U, 3U, 4U.
- Ceramic bearing system in pump guarantees low noise and long working life time.
- Precise helium leakage testing system(HLTS).
Boost Data Center Reliability with Closed-Loop Series Liquid Cooling Modules Description
1. Superior Thermal Management: Efficiently dissipates heat generated by high-performance servers, maintaining optimal operating temperatures and improving reliability
2. Energy Efficiency: Significantly reduces energy consumption compared to traditional air cooling systems, contributing to lower operational costs and a smaller carbon footprint
3. Compact Design: The integrated system fits seamlessly into server racks, optimizing space without compromising cooling performance
4. Minimal Maintenance: The closed-loop system is sealed and requires minimal maintenance, reducing downtime and operational costs
Boost Data Center Reliability with Closed-Loop Series Liquid Cooling Modules Data Sheet
| Waterblock | Dimensions | 118x78x25mm | |||
| Base | Copper | ||||
| Principalpart | Aluminum | ||||
| Pump | Model | A2 | |||
| Voltage | 12V | ||||
| Speed | 4000RPM | ||||
| Radiator | Dimensions | 408x73x80mm | |||
| Material | Aluminum | ||||
| Tube | Dimensions | Φ13x400mm | |||
| Material | PTFE | ||||
| Fan | Dimensions | 80x80x38mm | |||
| Voltage | 12V | ||||
| Speed | 9000RPM | ||||
| Air flow(max) | 126.98CFM | ||||
| Prerssure(max) | 50.69mm/H2O | ||||
| Noise | 65.0dBA | ||||
| Quantity | 4Pcs | ||||
| Powerdissipation | 700w | ||||
Closed-Loop Series Liquid Cooling Modules Applications
1.
Data Centers: These cooling modules are essential in modern data centers, where they help manage the significant heat generated by densely packed servers. By efficiently removing heat, they improve overall cooling efficiency, reduce energy consumption, and support higher server densities
2.
High-Performance Computing (HPC): In HPC environments, where computational tasks generate substantial heat, closed-loop liquid cooling ensures stable and efficient operation. This is crucial for applications such as scientific research, financial modeling, and complex simulations
3.
Enterprise Servers: For enterprise servers that require continuous operation and high reliability, closed-loop liquid cooling modules provide a robust solution. They help maintain optimal temperatures, extend equipment lifespan, and reduce the risk of overheating
4.
Artificial Intelligence and Machine Learning: AI and machine learning workloads often involve processing large datasets and performing complex computations, which generate significant heat. Closed-loop liquid cooling helps maintain efficient operating temperatures, enhancing overall system performance and reliability
5.
Telecommunications: In telecommunications infrastructure, closed-loop liquid cooling modules manage the heat produced by high-density equipment, ensuring reliable and efficient operation. This is particularly important as the demand for data and connectivity continues to grow
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