T-HS202301-AMD SP5 Liquid Cooling Plate delivers precision thermal control for high-performance servers. Featuring direct-contact copper base and 400W+ TDP capacity, it reduces CPU temps by 35°C vs air cooling. Ideal for AMD EPYC 9004 series. [Get Custom Cooling Solutions] →
T-HS202301-AMD SP5 Liquid Cooling Plate
High-Performance Liquid Cooling Plates for Data Centers
AMD CPU liquid cooling plate SP5 liquid cooling plate
The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively.
- Small batch customization with quick proofing
- High thermal conductivity material, precision processing.
- TLP welding, post-processing process.
- Efficient cooling performance, reliability and durability.
- Environmental protection and energy saving.
- Intelligent management, maintainability and flexibility.
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CPU GPU Liquid cold plates Description
- High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation.
- Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs.
- Precision Machining: Designed with high precision to ensure optimal contact and cooling performance.
- Durable Materials: Made from materials like copper or aluminum with anti-corrosion coatings for long-lasting use.
- Compact and Lightweight: Designed to fit within tight spaces while minimizing additional weight.
- Enhanced Cooling Efficiency: Features advanced flow channel designs to maximize heat removal and maintain stable operating temperatures.
CPU GPU Liquid cold plates Technical/Data Sheet
| Model | T-HS202301 |
| Category | AMD CPU |
| Welding process | pure copper TLP welding |
| heat source Total power | 500W |
| Working environment | 40°C,2LPM,25%EGW |
| cold plate surface temperature | below 52°C |
| flow resistance | Below 10KPa |
| Resistant to stress | 1Mpa |
CPU GPU Liquid cold plates Applications
- Computer Applications: CPU and GPU liquid cold plates are essential in high-performance computing, gaming PCs, data centers, and servers, ensuring efficient cooling for optimal performance and reliability
- Data Center Applications: CPU and GPU liquid cold plates are crucial in data centers for managing heat, enhancing cooling efficiency, and maintaining optimal performance and reliability of high-density servers.
- Server Applications: CPU and GPU liquid cold plates optimize cooling in servers, improving heat dissipation, maintaining performance, and extending the lifespan of high-performance computing components.
- Gaming PC Applications: CPU and GPU liquid cold plates enhance cooling in gaming PCs, boosting performance, reducing overheating, and enabling higher overclocking for smoother gameplay and improved system stability.
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