T-HS202301-AMD SP5 Liquid Cooling Plate

High-Performance Liquid Cooling Plates for Data Centers

AMD CPU liquid cooling plate SP5 liquid cooling plate

The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively.

Small batch customization with quick proofing
High thermal conductivity material, precision processing.
TLP welding, post-processing process.
Efficient cooling performance, reliability and durability.
Environmental protection and energy saving.
Intelligent management, maintainability and flexibility.

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Products Categories

Heat Sink

Tubed Cold Plates

CPU GPU Cold Plate

Vapor Chamber

Special-shaped Temperature Balancing Plates

Solar Type 3D Vapor Chamber

Temperature plate VC

Coolserver

TC-BGA 2518

TC-LGA 7529

TC-LGA 9324

TC-LGA 4189

TC-LGA 4677/4710

TC-LGA 1700/1851

LGA 3647 Narrow

TC-LGA 3647 Square

TC-LGA 2011 Narrow

TC-LGA 2066/2011 Square

TC-LGA 115X/1200

AMD SP7 Series

AMD SP6 Series

AMD SP5 Series

AMD SP3 Series

AMD AM5 Series

AMD AM4 Series

Tungsten Copper Alloy

Friction Stir Welded (FSW) liquid cold plate

Vacuum Brazed Liquid Cold Plate

AIO COOLER RADIATOR

CPU Cold Plate

GPU Cold Plate

IGBT cold plate

MOS Cold Plate

Battery Cold Plate

CPU GPU Liquid cold plates Description

High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation.
Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs.
Precision Machining: Designed with high precision to ensure optimal contact and cooling performance.
Durable Materials: Made from materials like copper or aluminum with anti-corrosion coatings for long-lasting use.
Compact and Lightweight: Designed to fit within tight spaces while minimizing additional weight.
Enhanced Cooling Efficiency: Features advanced flow channel designs to maximize heat removal and maintain stable operating temperatures.

CPU GPU Liquid cold plates Technical/Data Sheet

Model	T-HS202301
Category	AMD CPU
Welding process	pure copper TLP welding
heat source Total power	500W
Working environment	40°C,2LPM,25%EGW
cold plate surface temperature	below 52°C
flow resistance	Below 10KPa
Resistant to stress	1Mpa

CPU GPU Liquid cold plates Applications

Computer Applications: CPU and GPU liquid cold plates are essential in high-performance computing, gaming PCs, data centers, and servers, ensuring efficient cooling for optimal performance and reliability
Data Center Applications: CPU and GPU liquid cold plates are crucial in data centers for managing heat, enhancing cooling efficiency, and maintaining optimal performance and reliability of high-density servers.
Server Applications: CPU and GPU liquid cold plates optimize cooling in servers, improving heat dissipation, maintaining performance, and extending the lifespan of high-performance computing components.
Gaming PC Applications: CPU and GPU liquid cold plates enhance cooling in gaming PCs, boosting performance, reducing overheating, and enabling higher overclocking for smoother gameplay and improved system stability.

T-HS202301-AMD SP5 Liquid Cooling Plate delivers precision thermal control for high-performance servers. Featuring direct-contact copper base and 400W+ TDP capacity, it reduces CPU temps by 35°C vs air cooling. Ideal for AMD EPYC 9004 series. [Get Custom Cooling Solutions] →

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Send us your STEP/PDF file with TDP, coolant type, and flow requirements. Our engineers will deliver a thermal design proposal within 24 hours.

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✓ ISO 9001 Certified | ✓ MOQ 5 pcs | ✓ Prototype in 4–6 weeks | ✓ NDA Available

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MOQ 5 pcs • Prototype 7-15 days • ISO 9001 Certified

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